ASUS E35M1-I NA (integrated CPU) Mini ITX

ASUS E35M1-I NA (integrated CPU) Mini ITX

MPN: 90-MIBFQ0-G0AAY0DZ
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交货来源:
德国
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技术特点

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内存参数

无错误检测和更正 Y
支持的内存类型 DDR3-SDRAM
內存插槽数量 2
最大内部存储 8 GB

内置输入/输出系统

ATX电源接头 Y
USB 2.0接口 3
前面板音频接头 Y
CPU风扇接口 Y
SATA III连接器数量 6
机箱风扇接头数量 1

基本輸出輸入系統/BIOS

BIOS内存大小 4 MB
基本输入输出系统类型 AMI

扩展槽

PCI Express插槽版本 2.0
PCI Express x16 插槽 1

内容包装

快速安装向导 Y
包括驱动器 Y

背板输出端口

VGA(D-SUB)端口数量 1
麦克风/音频输入插孔 Y
耳机输出端口 1
PS/2连接埠数量 1
DVI-D接口数量 1

联网

网路功能 Gigabit Ethernet

性能

音频系统 VT1708S
主板芯片组系列 AMD
组件应用 PC

图像

板载图形适配器 Y

另外

图形适配器 Radeon HD 6310
以太网路(RJ-45)连接接口数量 1
E35M1-I, AMD E-350, AMD FCH A50, ATI Radeon HD 6310, SATA3, USB 2.0, Gigabit Ethernet, Mini ITX This motherboard supports integrated AMD Dual-Core Processor E-350 with AMD Radeon™ HD 6310 Graphics. This revolutionary APU (Accelerated Processing Unit) combines processing power and advanced DirectX 11 graphics in one small, energy-efficient design to enable accelerated performance and an industry-leading visual experience. It features single-channel DDR3 1066 memory support and accelerates data transfer rate up to 2.5GT/s.

AMD® FCH A50 (Hudson M1) is designed to support up to 2.5GT/s interface speed and PCI Express 2.0 x 16 (at x4 speed) graphics. It supports 6 x SATA6Gb/s ports and 14 x USB 2.0 Ports.

The AMD® FCH A50 chipset natively supports next-generation Serial ATA (SATA) storage interface, this motherboard delivers up to 6.0 Gb/s data transfer rates. Additionally, get enhanced scalability, faster data retrieval, double the bandwidth of current bus systems.

With its user-friendly interface, ASUS AI Suite II consolidates all exclusive ASUS features into one simple-to-use package. It allows users to supervise overclocking, energy management, fan speed, voltage and sensor readings, even interact with mobile devices via Bluetooth. This all-in-one software offers diverse and easy to use functions, with no need to switch back and forth between different utilities.

This motherboard uses all high-quality conductive polymer capacitors onboard for durability, improved lifespan, and enhanced thermal capacity.
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