性能
主板元件 |
Micro ATX |
主板芯片组系列 |
Intel |
音频系统 |
Realtek ALC887 |
组件应用 |
PC |
冷却方式 |
Passive |
内存参数
可支持内存时钟速度 |
1066, 1333 MHz |
无错误检测和更正 |
Y |
内存通道支持 |
Dual |
支持的内存模块容量 |
2GB, 4GB, 8GB |
內存插槽数量 |
2 |
最大内部存储 |
16 GB |
基本輸出輸入系統/BIOS
BIOS内存大小 |
32 MB |
ACPI的版本 |
2.0a |
处理器
SMP(适用于表面安装的封装形式)处理器的最大数量 |
1 |
内置输入/输出系统
USB 2.0接口 |
2 |
S/PDIF输出端口 |
Y |
串列ATA连接器数量 |
4 |
并行ATA连接器 |
1 |
ATX电源接头 |
Y |
风扇电源接头 |
Y |
SATA II连接器数量 |
4 |
CPU风扇接口 |
Y |
COM连接器数量 |
1 |
机箱防盗接口 |
Y |
机箱风扇接头数量 |
1 |
EATX电源接头数量 |
1 |
前面板音频接头 |
Y |
图像
DirectX版本 |
10.1 |
板载图形适配器 |
N |
分立图形支持 |
Y |
内容包装
试用软件 |
Antivirus |
包括驱动器 |
Y |
快速安装向导 |
Y |
背板输出端口
DVI-D接口数量 |
1 |
PS/2连接埠数量 |
2 |
S/PDIF输出接口 |
Y |
麦克风/音频输入插孔 |
Y |
HDMI端口数量 |
1 |
VGA(D-SUB)端口数量 |
1 |
扩展槽
PCI 插槽 |
1 |
PCI Express x16 插槽 |
1 |
PCI Express × 1插槽 |
2 |
另外
主板晶片 |
Intel H61 |
系统总线 |
5 GT/s |
以太网连接器 |
Y |
以太网路(RJ-45)连接接口数量 |
1 |
P8H61-M REV 3.0, uATX, Intel Socket 1155, Intel H61(B3), 2x DIMM, 1x PCIe 2.0 x16, 2x PCIe 2.0 x1, 1x PCI, 4x SATA 3.0 Gb/s, Gigabit Ethernet, Realtek ALC887 8ch, 10x USB 2.0/1.1
LGA1155 socket for Intel® Second Generation Core™ i7/ Core™ i5/ Core™ i3 Processors
This motherboard supports the Intel® second generation Core™ i7 / Core™ i5 / Core™ i3 processors in LGA1155 package with memory and PCI Express controllers integrated to support 2-channel (2 DIMMs) DDR3 memory and 16 PCI Express 2.0 lanes. This provides great graphics performance. Intel® second generation Core™ i7 / Core™ i5 / Core™ i3 processors are among the most powerful and energy efficient CPUs in the world.
Intel® H61(B3) Express Chipset
The Intel® H61(B3) Express Chipset is the latest single-chipset design to support the new 1155 socket Intel® Core™ i7 / Core™ i5 / Core™ i3 2nd generation processors. It provides improved performance by utilizing serial point-to-point links, allowing increased bandwidth and stability. Additionally, the H61 (B3) provides 4 SATA 3.0 Gb/s ports for faster data retrieval at double the bandwidth of current bus systems.
Dual-Channel DDR3 1333 / 1066 support
The motherboard supports DDR3 memory that features data transfer rates of 1333 / 1066 MHz to meet the higher bandwidth requirements of the latest 3D graphics, multimedia, and Internet applications. The dual-channel DDR3 architecture enlarges the bandwidth of your system memory to boost system performance.
100% All High-quality Conductive Polymer Capacitors
This motherboard uses all high-quality conductive polymer capacitors onboard for durability, improved lifespan, and enhanced thermal capacity.
EPU
Tap into the world’s first real time PC power saving engine through AI Suite II utility. Get total system power savings by automatically detecting current PC loadings and intelligently moderating power consumption. This also reduces fan noise and extends component longevity.
GPU Boost
GPU Boost overclocks the integrated GPU in real time for the best graphics performance. User-friendly UI facilitates flexible frequency and voltage adjustments. Its ability to deliver multiple overclocking profiles also provides rapid and stable system-level upgrades.
TurboV
Easy, Real-Time O.C. Tunings
Feel the adrenaline rush of real-time OC-now a reality with the ASUS TurboV. This easy OC tool allows you to overclock without exiting or rebooting the OS; and its user-friendly interface makes overclock with just a few clicks away. Moreover, the ASUS OC profiles in TurboV provides the best O.C. settings in different scenarios.