性能
| 主板元件 |
Micro ATX |
| 处理器插座 |
LGA 1151 (Socket H4) |
| 主板芯片组系列 |
Intel |
| 组件应用 |
PC |
内存参数
| 可支持内存时钟速度 |
1866, 2133 MHz |
| 支持的内存类型 |
DDR4-SDRAM |
| 内存插槽类型 |
DIMM |
| 內存插槽数量 |
2 |
| 最大内部存储 |
32 GB |
内置输入/输出系统
| USB 2.0接口 |
2 |
| USB 3.0（第 1代3.1）连接器 |
1 |
| SATA III连接器数量 |
4 |
| CPU风扇接口 |
Y |
| 机箱风扇接头数量 |
1 |
| 前面板音频接头 |
Y |
| 串行端口接头连接器 |
1 |
| 前面板接头 |
Y |
图像
| DirectX版本 |
12.0 |
| 板载图形适配器 |
N |
| HDCP |
Y |
技术细节
| 散热设计功耗 (TDP) |
91 W |
| 集成网卡 |
Y |
| SATA 连接口总数 |
4 |
| USB版本 |
2.0/3.0 (3.1 Gen 1) |
扩展槽
| PCI Express x1（Gen 2.x）插槽 |
1 |
| PCI Express X16（Gen 2.x）插槽 |
1 |
背板输出端口
| PS/2连接埠数量 |
2 |
| USB 3.0（第 1代3.1）Type-A 端口数量 |
2 |
| USB 连接器形状 |
USB Type-A |
| VGA（D-SUB）端口数量 |
1 |
另外
| 主板晶片 |
Intel H110 |
| 以太网连接器 |
Y |
| 以太网路(RJ-45)连接接口数量 |
1 |
Intel H110, Intel Core i7 LGA 1151, Intel Core i5 LGA 1151, Intel Core i3 LGA 1151, Intel Pentium LGA 115, Intel Celeron LGA 1151, TDP 91 W, DDR4 2133/1866 MHz, DIMM, 32 GB, PCI-E x16 3.0, PCI-E x1 2.0, SATA3, USB 3.0, USB 2.0, Realtek TRL8111H, Realtek ALC887, PS/2, VGA, RJ-45, Micro ATX, Windows 7/8.1/10
- Support 6th Generation Intel® Core™ Processor
- Intel H110 single chip architecture
- Support 2-DIMM DDR4-2133/ 1866 up to 32G maximum capacity
- Support GbE LAN
- Support USB 3.0
Audio+
HD Audio
Provides high quality sound with minimal loss of audio fidelity.
Video+
DX12
DirectX 12 introduces the next version of Direct3D, the graphics API at the heart of DirectX. Direct3D is one of the most critical pieces of a game or game engine, and we've redesigned it to be faster and more efficient than ever before. Direct3D 12 enables richer scenes, more objects, and full utilization of modern GPU hardware.
Speed+
PCI-E Gen 3.0
PCI-E 3.0 is the next evolution of the ubiquitous and general-purpose PCI Express I/O standard. At 8GT/s bit rate, the interconnect performance bandwidth is doubled over PCI-E 2.0, while preserving compatibility with software and mechanical interfaces.
USB 3.0
Experience Fastest data transfers at 5 Gbps with USB 3.0--the new latest connectivity standard. Built to connect easily with next-generation components and peripherals, USB 3.0 transfers data 10X faster and backward compatible with previous USB 2.0 components.
Durable+
Moistureproof PCB
The popularity of PC usage and working environment is getting deteriorating and moist(rural, coastal, etc.). The PCB will be oxidizing easily by damp or absorbed moisture, and ionic migration or CAF (Conductive Anodic Filament) will be generated. Moisture-proof PCB meets high density and high reliability requirements for moisture proof.
Low RdsOn P-Pak MOS
Low resistance design can significantly reduce the current out of energy loss.Low temperature, small size, excellent thermal conductivity.
Protection+
Super Anti-Surge Protection
BIOSTAR exclusive Anti-Surge design provides the best protection of board and extends the product life. Having the latest model of "Transient Voltage Suppressor" on- board can effectively protect the board circuit, reducing the shocks caused by ESD as well as other damages arising from overvoltage transients to enhance system durability.
Super LAN Surge Protection
Super LAN Surge Protection, providing LAN port with more advanced antistatic protection capabilities by adding an integrated chip to strengthen electrical stability and prevent damage from lightning strikes and electrical surges. SLSP (Super LAN Surge Protection) series motherboard upgrades the existing system protection standards with maximum 4X protection comparing to other board makers.
ESD Protection
ESD (Electrostatic Discharge) is the major factor to destroy PC by electrical overstress(EOS) condition, ESD occurred by PC users when touch any devices connect to PC, which may result in damage to motherboard or parts .ESD protection is designed to protect the motherboard and equipment from damage by EOS
USB Polyswitch
On board dedicated power fuse to help prevent USB port failure. It prevents USB Port overcurrent and safegurand your system and device lifespan.
OC / OV / OH Protection
All BIOSTAR special circuit design detects overvoltage conditions and prevents voltage surges from spreading in real time. It also actively cuts off the overvoltage supply to protect your system. Over current protection, avoid motherboard from damage when doing overclock or an unusual current import. Over heat protection, avoid motherboard & CPU from burning when exceeding the temperature limitation.
High Quality ESD
BIOSTAR Hi-Fi series motherboards provide high quality ESD (Electro-Static Discharge) solution for its front I/O panel. This function prevents static electricity and reduces the damage to the motherboards when you are plugging or unplugging your headphone.
DIY+
Header Zone
Users can easily assemble their own computer, a simple-swap data discs and other accessories.
CPU-Chipset Features
Intel H110 chipset
The Intel® H110 chipset is a single-chipset design to support socket 1151 Intel® 6th generation Intel® Core™ processor-based platform. Provides excellent performance and increased bandwidth and stability. Intel® H110 chipset can also enable iGPU function, letting users enjoy the latest Intel® integrated graphic performance. The PC platform features improved adaptive performance that adds speed when you need it. When combined with advanced system responsiveness, the platform delivers the ultimate PC experience.
