技术细节
处理器插座 |
LGA 1366 (Socket B) |
The MC-TDX waterblock is designed to provide optimum performance to the Multi-Core and Multi-Die processors currently on the market and soon to be released products.
Features:
- 100% copper 110 material
- Acrylic and brass top options
- Threaded fitting ports are G 1/4 BSPP for use with any similar spec fittings.
- Complete Block with O-Ring
- Pressure Tested to 50psi
- Fittings sold separately
- Machine lapped and flat mirror polished
- Stainless steel hold down
Benefits:
- 240 Heat Dissipating Columns for enhanced transfer of heat to the water and optimum coverage of the CPU
- Significant temperature drops on Quad Core and multiple die processors. (5-10 Degrees Celsius observed on lab QX6800 processors depending on radiator size and ambient room temperature)
- Ready to install designed and tuned for your system for top performance
- Anti-Tarnish coating applied to prevent finger print or environmental changes. This specialized formula also has no affect on cooling potential.
- Corrosion will not occur when used with other Copper and Brass parts. Avoid using non-anodized aluminum (or all aluminum) if at all possible for maximum component life.
Notes:
- Verify proper mount before power up. Check the thermal compound imprint and verify the block isn't touching any capacitors.
- Optional backplate is 1/8" acrylic and covers the Intel Backplate. A gasket surround the Intel backplate for additional protection.