产品特点
| 双频带 |
Y |
| 待机功耗 |
13 mW |
| 待机功耗（无线网络） |
35 mW |
| 待机功耗（蓝牙） |
21.5 mW |
| USB On-The-Go支持 |
Y |
处理器
| 核心的处理器数量 |
2 |
| CPU配置（最大） |
1 |
| 微控制器頻率 |
100 MHz |
| 微控制器型號 |
Intel Quark |
| 处理器光刻 |
22 nm |
| 处理器频率 |
500 MHz |
端口 & 界面
| 蓝牙 |
Y |
| USB 端口数量 |
1 |
| USB版本 |
2.0 |
| 无线局域网连接 |
Y |
内存参数
| 闪存类型 |
NAND |
| 内存时钟速度 |
800 MHz |
| 内存类型 |
LPDDR3 |
| 闪存 |
4096 MB |
| 最大内部存储 |
1 GB |
Intel Edison Breakout Kit
The Intel® Edison development platform is the first in a series of low-cost, product-ready, general purpose compute platforms that help lower the barriers to entry for entrepreneurs of all sizes—from pro-makers to consumer electronics and companies working in the Internet of Things (IoT).
Intel® Edison packs a robust set of features into its small size, delivering great performance, durability, and a broad spectrum of I/O and software support. Those versatile features help meet the needs of a wide range of customers.
This breakout kit is designed for non-Arduino users. This breakout board has a minimalistic set of features and is slightly larger than the Edison module.
<b>FEATURES</b>
- Uses a 22nm Intel® SoC that includes a dual core, dual threaded Intel® Atom™ CPU at 500MHz and a 32-bit Intel® Quark™ microcontroller at 100 MHz. It supports 40 GPIOs and includes 1GB LPDDR3, 4 GB EMMC, and dual-band WiFi and BTLE on a module slightly larger than a postage stamp
- The Intel Edison module will initially support development with Arduino* and C/C++, followed by Node.JS, Python, RTOS, and Visual Programming support in the near future
- The Intel Edison module includes a device-to-device and device-to-cloud connectivity framework to enable cross-device communication and a cloud-based, multi-tenant, time-series analytics service
