性能
| 适用于 |
Processor |
| 风扇直径 |
N mm |
| 处理器插座 |
LGA 1366 (Socket B) |
EK-TIM Indigo Xtreme, Intel 1366
EK-TIM Indigo Xtreme represents a whole new approach to high-performance cooling of your CPU.
EK-TIM Indigo Xtreme is an Engineered Thermal Interface (ETI) that fits neatly between a CPU lid and water block (or heat sink) to keep CPUs cooler. Unlike greases, metallic thermal interface pads or liquid metal alloys, Indigo Xtreme™ is a self-contained and sealed structure, deploying a Phase Change Metallic Alloy (PCMA) which reflows and fills surface asperities on the CPU lid and heat sink. Indigo Xtreme™ achieves high thermal performance through the optimized deployment of molten, oxide-free PCMA, thereby yielding low contact resistance and low bulk resistance. The resultant interfacial layer is void-free and robust, with low thermal contact and bulk resistance.
High Thermal Performance:
- Bulk thermal conductivity >20 W/mK
- Lowest overall thermal resistance of any TIM available today
- Superior performance right out of the gate
High Reliability:
- Fully sealed structure - no mess or migration
- Most consistent performance - applies the correct amount of alloy every time
- Gallium-free
- Laser-cut precision
User Friendly:
- Fully compatible with copper and aluminum surfaces
- Peel-and-stick application
- Easy clean up - just peel to remove
Extent of delivery:
- two (2) EK-TIM Indigo Xtreme applicators
- one (1) Indigo Xtreme Thermal Surface Cleaner
- one (1) pair of powder-free nitrile gloves
- cleanroom-grade dry wiper cloths
- installation manual
