性能
| DirectX版本 |
10.1 |
| OpenGL版本 |
3.1 |
| 最高着色模型版本 |
4.1 |
| HDCP |
Y |
| 集成电视调谐器 |
N |
| PhysX |
N |
内存参数
| 图形适配器内存类型 |
GDDR3 |
| 数据宽度 |
128 bit |
| 独立显卡适配器內存 |
1 GB |
| 内存时钟速度 |
1600 MHz |
处理器
| 图形适配器随机存取存储器数字/模拟转换器 |
400 MHz |
| 图形处理器系列 |
AMD |
| 最大模拟分辨率 |
2048 x 1536 pixels |
| 处理器频率 |
750 MHz |
| 最大数字分辨率 |
2560 x 1600 pixels |
端口 & 界面
| 接口类型 |
PCI Express 2.0 |
| HDMI端口数量 |
1 |
| VGA（D-SUB）端口数量 |
1 |
HD 4670 iSilence4 Native HDMI 1GB, DDR3, 128 bit, PCI Express 2.0
<b>The Ultimate Silence Media Center PC!</b>
HIS unveils the HD 4670 iSilence 4 PCIe Card, deliver the ultimate silence solution for media center PC. Featuring the famous Korean cooling expertise’s product – ZALMAN VNF100, it maximizes cooling efficiency while provide a silence environment for gaming and multi-media entertainment.
<b>Cross over with Zalman latest innovative heatpipe solution</b>
It is cooled by the well-known Korean cooling expertise’s product – ZALMAN VNF100. With Zalman’s patented VFP (Variable Fin Profile) Fin Design, it maximizes cooling efficiency and dissipation surface area for excellent performance. As VNF100 is fanless, it does not emit any noise and can be used semi-permanently. Coming with 3 high performance heatpipes, it maximizes heat transfer. The thin aluminium fins (0.4mm) provide minimized heatsink weight, and prevents excessive force on the VGA card. More importantly, the heatsink is positioned above the VGA card that optimizes cooling efficiency and allows compatibility with CrossFire setups.
<b>Performance Test</b>
Test is setup to compare the temperature difference between the HD4670 iSilence 4 model and the HD4670 standard cooler. From the following graph, the HIS iSilecnce 4 cools down the GPU temperature by up to 10%. Passively cooled by the passive cooler Zalman VNF100, the newly designed heatpipes convey heat to a large and dense array of aluminium fins, effectively cool down the temperature and ensure the station runs in stable condition.
<b>What Expert Says</b>
With the location of these fins being above the PCB in most installations, better cooling is achieved with air heated by the card moving upwards.” – TechPowerUp.com
