内存参数
| 内存插槽数量 |
6x DIMM |
| 内置存储器 |
2 GB |
| 内存类型 |
DDR2-SDRAM |
| 最大内部存储 |
24 GB |
处理器
| 处理器运行模式 |
64-bit |
| 可选用的嵌入式选项 |
N |
| FSB奇偶校验 |
Y |
| 核心的处理器数量 |
4 |
| Number of Processing Die Transistors |
820 M |
| 处理器前端汇流总线 |
1333 MHz |
| 处理器高速缓存类型 |
L2 |
| 执行禁止位 |
Y |
| 处理器高速缓存 |
12 MB |
| 处理器安装数量 |
1 |
| SMP(适用于表面安装的封装形式)处理器的最大数量 |
1 |
| 散热设计功耗 (TDP) |
80 W |
| 处理器光刻 |
45 nm |
| 处理器频率 |
2.83 GHz |
处理器的特殊功能
| 英特尔®超线程技术 |
N |
| 英特尔®Turbo Boost技术 |
N |
| 英特尔®64 |
Y |
| Processor ARK ID |
35279 |
| 英特尔®虚拟化技术(VT -x) |
Y |
| 英特尔®可信执行技术 |
N |
| 增强型英特尔®SpeedStep动态节能技术 |
Y |
| 英特尔®VT-x的扩展页表(EPT) |
Y |
存储介质
| 热插拔 |
Y |
| 硬盘接口 |
Serial Attached SCSI (SAS) |
| 最大存储容量 |
0.292 TB |
扩展槽
| PCI Express x8插槽 |
1 |
| PCI-X 插槽 |
1 |
联网
| 连网功能 |
Y |
| 网路功能 |
Gigabit Ethernet |
另外
| Processing die size |
214 mm² |
BladeCenter HS12, Intel X3363, 2.83 GHz, 1333 MHz, 2GB DDR2, SAS, Gigabit Ethernet
-Provides similar performance, integration and reliability as dual-processor servers, at a more affordable price point.
-Deploys quickly and manages tasks with no loss of uptime.
-Helps reduce power and cooling costs to boost data center efficiency.
The IBM BladeCenter® HS12 is a uniprocessor blade that offers the same uptime and availability features as dual-processor servers—at a lower price.
An affordable solution
The HS12 combines power and easy integration to offer a flexible, low-cost option for small businesses, a wide choice of processors, and the same availability features found on dual-processor servers—so organizations can run their IT without investing in a data center.