处理器
处理器支持 ECC 功能 |
N |
外壳温度 |
72.6 °C |
处理器支持最大内存 |
16 GB |
处理器频率 |
2.8 GHz |
处理器运行模式 |
64-bit |
可选用的嵌入式选项 |
Y |
FSB奇偶校验 |
N |
Number of Processing Die Transistors |
382 M |
PCI Express配件 |
2x8, 1x16 |
无冲突处理器 |
N |
处理器支持内存带宽(最大值) |
17 GB/s |
处理器高速缓存类型 |
Smart Cache |
处理器代号(codename) |
Clarkdale |
实体位址扩充(PAE) |
36 bit |
PCI Express 通道数的最大值 |
16 |
热监测技术 |
N |
执行禁止位 |
Y |
处理器光刻 |
32 nm |
图形与IMC光刻 |
45 nm |
处理器高速缓存 |
3 MB |
处理器安装数量 |
1 |
核心的处理器数量 |
2 |
SMP(适用于表面安装的封装形式)处理器的最大数量 |
1 |
散热设计功耗 (TDP) |
73 W |
总线频率 |
21 |
处理器封装尺寸 |
37.5 mm |
总线类型 |
DMI |
处理器的特殊功能
增强型英特尔®SpeedStep动态节能技术 |
Y |
英特尔® FDI技术 |
Y |
英特尔®VT-x的扩展页表(EPT) |
Y |
英特尔®vPro™ 技术 |
N |
英特尔®MID清晰视频技术 |
N |
英特尔® 我的WiFi技术 |
N |
英特尔® 增强暂停状态 |
Y |
英特尔®超线程技术 |
N |
英特尔® 防盗技术 |
N |
英特尔®直接输入/输出硬件辅助虚拟化技术 (Intel® VT-d) |
N |
CPU配置(最大) |
1 |
英特尔® 双显示功能技术 |
Y |
英特尔® 清晰视频技术 |
N |
英特尔®64 |
Y |
英特尔® 内线™ |
N |
英特尔®快速同步视频技术 |
N |
Processor ARK ID |
43230 |
英特尔®可信执行技术 |
N |
英特尔® Flex内存访问 |
N |
英特尔® 快速内存访问 |
N |
英特尔®快速存储技术 |
N |
英特尔®Turbo Boost技术 |
N |
英特尔®清晰视频高清技术 |
N |
英特尔®无线显示(WiDi)技术 |
N |
英特尔®基于需求开关 |
N |
存储介质
硬盘接口 |
Serial ATA |
最大存储容量 |
4 TB |
总存储容量 |
250 GB |
安装的硬盘驱动器的数量 |
1 |
热插拔 |
Y |
扩展槽
PCI Express插槽版本 |
2.0 |
PCI Express × 4插槽 |
2 |
PCI Express x8插槽 |
2 |
PCI 插槽 |
2 |
其他功能
热插拔硬盘驱动器托架 |
4x 3.5" SATA/SAS, 8x 2.5" SAS |
内存参数
最大内部存储 |
32 GB |
内置存储器 |
1 GB |
内存类型 |
DDR3-SDRAM |
图像
板载图形适配器基本频率 |
533 MHz |
板载图形适配器 |
Y |
板载图形适配器支持的显示器数量 |
2 |
另外
系统总线 |
2.5 GT/s |
Processing die size |
81 mm² |
InTru™3D技术 |
N |
以太网路(RJ-45)连接接口数量 |
2 |
英特尔®AES新指令 |
N |
System x3200 M3, Intel Pentium Dual Core G6950 (2.80GHz, 3MB), 1024MB PC3-10600 DDR3 RAM, 250GB SATA HDD, DVD-ROM/CD-RW, Gigabit Ethernet
Highlights
-Boost productivity with new high-performance capabilities, vast memory and expanded storage capacity.
-Save on energy costs with integrated power management tools.
-Improve manageability and security with powerful built-in features.
The IBM System x3200 M3 offers enhanced performance to help you take on the dynamic challenges of running IT with an emphasis on security, simplicity, efficiency and reliability – delivered at the right price in a single-socket tower server.
High-performance capabilities
The x3200 M3 supports the latest Intel® Xeon® quad-core and Celeron®, Pentium® and Core i3 dual-core processors for exceptional performance. Because your organisation must manage growing volumes of data while maintaining high performance, the x3200 M3 offers vast memory capacity and disk storage.
Product features
-Easy installation and management with a rich set of options for hard disk drives (HDDs) and memory.
-Efficient design to help you save energy and provide a better work environment with less heat and noise.
-Proven IBM platform tested and certified for quality and reliability.
-Superior serviceability and manageability with features such as the Virtual Media Key, Trusted Platform Module (TPM) 1.2 and Integrated Management Module (IMM) to meet the needs of today’s complex desk-side environment.
-Economical price point and total cost of ownership (TCO).
Hardware summary
-Rack-mountable tower form factor.
-Choice of processor – Intel® Xeon® Processor x3400 Series (quad-core) or Intel Celeron, Pentium or Core i3 (dual-core).
-Up to 32 GB memory, with DDR-3 ECC memory, up to 1333 MHz; 1 GB, 2 GB and 4 GB Unregistered Dual Inline Memory Module (UDIMM); 1 GB, 2 GB, 4 GB and 8 GB.
-registered Dual Inline Memory Module (RDIMMs).
-Flexible storage options – four 3.5" simple-swap or hot-swap Serial Advanced Technology Attachment (SATA) HDDs. Eight 2.5" hot-swap Serial Attached SCSI (SAS) HDDs (2.5" HDD cage will be available for special bid through sales configuration tool).
-Up to 4.0 TB SAS or SATA HDDs.
-Models with hot-swap, redundant power supplies (model dependent).
-DVD-ROM/CD-RW to provide maximum optical drive flexibility.
-Dedicated slot for • Redundant Array of Independent Disk.
-(RAID)-0, -1 controller protects data and leaves other valuable slots free.
-Integrated IMM with IPMI 2.0 support offers better control and manageability of your system.
-Internal tape backup options.