处理器
处理器支持最大内存 |
16 GB |
处理器频率 |
2.93 GHz |
步进 |
C2 |
处理器运行模式 |
64-bit |
可选用的嵌入式选项 |
N |
FSB奇偶校验 |
N |
总线频率 |
22 |
Number of Processing Die Transistors |
382 M |
PCI Express配件 |
2x8, 1x16 |
无冲突处理器 |
N |
处理器支持内存带宽(最大值) |
21 GB/s |
处理器高速缓存类型 |
Smart Cache |
核心的处理器数量 |
2 |
处理器代号(codename) |
Clarkdale |
实体位址扩充(PAE) |
36 bit |
PCI Express 通道数的最大值 |
16 |
热监测技术 |
N |
执行禁止位 |
Y |
图形与IMC光刻 |
45 nm |
处理器高速缓存 |
4 MB |
处理器安装数量 |
1 |
SMP(适用于表面安装的封装形式)处理器的最大数量 |
1 |
散热设计功耗 (TDP) |
73 W |
处理器光刻 |
32 nm |
处理器封装尺寸 |
37.5 mm |
总线类型 |
DMI |
支持指令集 |
SSE4.2 |
处理器支持 ECC 功能 |
N |
外壳温度 |
72.6 °C |
处理器的特殊功能
英特尔®MID清晰视频技术 |
N |
英特尔® 我的WiFi技术 |
N |
英特尔® 增强暂停状态 |
Y |
英特尔®超线程技术 |
Y |
英特尔® 防盗技术 |
N |
英特尔®直接输入/输出硬件辅助虚拟化技术 (Intel® VT-d) |
N |
英特尔®Turbo Boost技术 |
N |
CPU配置(最大) |
1 |
英特尔® 双显示功能技术 |
Y |
英特尔® 清晰视频技术 |
N |
英特尔®64 |
Y |
英特尔® 内线™ |
N |
英特尔®快速同步视频技术 |
N |
Processor ARK ID |
46472 |
英特尔®可信执行技术 |
N |
英特尔® Flex内存访问 |
N |
英特尔® 快速内存访问 |
N |
英特尔®快速存储技术 |
N |
英特尔®清晰视频高清技术 |
Y |
英特尔®无线显示(WiDi)技术 |
N |
英特尔®基于需求开关 |
N |
增强型英特尔®SpeedStep动态节能技术 |
Y |
英特尔® FDI技术 |
Y |
英特尔®VT-x的扩展页表(EPT) |
Y |
英特尔®vPro™ 技术 |
N |
存储介质
RAID支持 |
N |
最大存储容量 |
4 TB |
热插拔 |
N |
硬盘接口 |
Serial ATA |
内存参数
最大内部存储 |
24 GB |
内存插槽数量 |
6x DIMM |
内存类型 |
DDR3-SDRAM |
内存时钟速度 |
1333 MHz |
内置存储器 |
1 GB |
图像
板载图形适配器基本频率 |
733 MHz |
板载图形适配器系列 |
Intel HD Graphics |
板载图形适配器 |
Y |
最大图形显示内存 |
16 MB |
板载图形适配器支持的显示器数量 |
2 |
其他功能
CD读取速度 |
16 x |
支持数据传输率 |
10/100/1000Mbps |
端口 & 界面
并口数量 |
1 |
串口数量 |
2 |
VGA(D-SUB)端口数量 |
1 |
认证标准
遵守工业标准 |
IEEE 802.3, IEEE 802.3u, IEEE 802.3ab |
另外
Processing die size |
81 mm² |
InTru™3D技术 |
N |
以太网路(RJ-45)连接接口数量 |
1 |
英特尔®AES新指令 |
N |
以太网连接器 |
Y |
系统总线 |
2.5 GT/s |
图形适配器 |
G200 |
System x3200 M3, Intel Core i3-530(2.93GHz), Serial ATA, 1GB DDR3, Matrox G200, Gigabit Ethenet, DVD-ROM, 25200g, Black
Features of the System x3200 M3 server include:
- The latest Intel® Celeron® and Core i3 processors;
- Standard system DDR-3 ECC memory including 1 GB, 2 GB, and 4 GB UDIMMs and 1 GB, 2 GB, 4 GB, and 8 GB RDIMMs (support for UDIMM or RDIMM is processor dependent);
- Integrated Serial-ATA (SATA) and Serial Attached SCSI (SAS) controllers, depending on model;
- Tower to Rack mount kit support through a rack conversion kit option (model dependent, rack mount kit does not support 11 bays);
- Five available I/O expansion slots (plus dedicated PCI-E slot for the RAID controller);
- Hardware-based RAID striping (RAID-0) and mirroring (RAID-1) standard without consuming an I/O expansion slot, standard for hot-swap models, optional for simple swap models; optional hardware RAID-5, depending on model;
- Optional Hardware Key for remote presence;
- Up to eleven total bays (special bid only): two 5.25-inch, one 3.5-inch for optional diskette drive, and four 3.5-inch or up to eight 2.5-inch for HDDs;
- SATA DVD-ROM;
- One fixed 400® W power supply; two 430 W redundant power supplies (CTO/model dependent);
- System management support;
- I/O ports:
- Seven USB (four rear, two front, one internal);
- Support for Dual Gigabit Ethernet for greater bandwidth and redundancy; one Gigabit shared to system management;
- One software-compatible serial port;
- Integrated Matrox graphics controller with 16 MB video memo.
Overview
The IBM® System x3200 M3 offers enhanced features and performance to help you take on the dynamic challenges of running IT with an emphasis on security, simplicity, efficiency, and reliability -- delivered at the right price in a single-socket tower.
Value and performance
- Powerful Intel processor:
- Celeron G1101;
- Core i3-530;
- Optimized for EM64T to support 32-bit or 64-bit applications;
- Six expansion slots:
- Two 32-bit/33 MHz PCI;
- Two PCI-Express x8;
- Two PCI-Express x4 (one dedicated to RAID controller);
- Integrated Gigabit Ethernet controller;
- Choice of HDD:
- 3.5-inch SATA, 3.5-inch SAS;
- 2.5-inch SAS;
- Seven drive bays standard;
- Open bay models supporting simple-swap SATA, hot-swap SATA, or hot-swap SAS HDD;
- Fixed 400 W power supply; two 430W redundant power supply (CTO/model dependent).