处理器
| 处理器安装数量 |
1 |
| SMP(适用于表面安装的封装形式)处理器的最大数量 |
2 |
| 散热设计功耗 (TDP) |
65 W |
| 处理器光刻 |
65 nm |
| 处理器频率 |
2 GHz |
| 处理器前端汇流总线 |
1333 MHz |
| 处理器高速缓存类型 |
L2 |
| 处理器高速缓存 |
4 MB |
设计
| 光驱类型 |
DVD-ROM |
| 机箱板型 |
Rack (2U) |
存储介质
| 硬盘接口 |
Serial Attached SCSI (SAS) |
| 总存储容量 |
1270 GB |
| 安装的硬盘驱动器的数量 |
1 |
| 硬盘容量 |
36.4 GB |
内存参数
| 最大内部存储 |
48 GB |
| 内存插槽数量 |
12x DIMM |
| 内置存储器 |
1 GB |
| 内存类型 |
DDR2-SDRAM |
另外
| 图形适配器 |
RN50 |
| 以太网路(RJ-45)连接接口数量 |
2 |
System x3650, 1x Dual-Core Intel Xeon 5130 2.0 GHz/1333 MHz (4 MB L2), 1024 MB PC2-5300 DDR2 AMF ECC DRAM, 1x36.4GB 3Gb SAS HD, CD-RW/DVD-ROM combo, 2x Broadcom Gigabit Ethernet, ATI RN50 (16 MB), 1x 835 W
New levels of speed and performance
For constrained data centre environments, the IBM System x3650 offers unprecedented performance and reliability. Optimised for up to four-core processor performance, the x3650 delivers rack-dense, dual-core computing power, an impressive 12 DIMM memory design and super-efficient network communication.
Protect your IT investment
Scalable memory and I/O design satisfy high-speed processing and reliability requirements, while integrated RAID safeguards data. Hot-swap power and cooling with Calibrated Vectored Cooling and IBM PowerExecutive help keep your server cool. The result? Run two different workloads on a two-socket server – without running out of IT funds.