技术细节
| 最大气流 |
88.93 cfm |
| 最小气流 |
34.8 cfm |
| 散热器 |
Y |
| 风扇 |
Y |
| 处理器插座 |
Socket AM3, Socket FM2, Socket AM2, LGA 1151 (Socket H4), Socket FM1, Socket AM1 |
| 风扇速度(最大) |
2300 RPM |
| 风扇速度(最小) |
900 RPM |
重量和尺寸
| 风扇直径 |
120 mm |
| 管长 |
300 mm |
| 风扇厚度 |
38 mm |
200W, 12V
Support CPU Overclocking Power Mode up to 200W Heat Dissipation
For Desktop Tower Chassis
Desktop Liquid Cooling Solution Recommended for :
- IntelProcessor, SocketLGA2011, Square ILM Mounting
- Intel® Processor, Socket LGA2011, Narrow ILM Mounting
- Intel® Processor, Socket LGA1365, 1366
- Intel® Processor, Socket LGA1150, 1155, 1156
- AMD® Processor, Socket AM2, AM2+, AM3, FM1, FM2
Cold Plate Module with Copper Base
Space Saver Light Weight Radiator
12cm Cooling Fans with 4-Pin PWM Connector
Stand-alone Water Pump with Powerful Flow Rate 0.84 Litter Per Minute
30cm Black Pair EPDM Tube Assembled
Mounting Accessories are included
Shin-Etsu Series Thermal Compound Pre-Printed on Base
Support CPU Overclocking Power Mode up to 200Watts Heat Dissipation