存储介质
| 热插拔 |
Y |
| 硬盘尺寸 |
2.5 " |
| RAID支持 |
Y |
| 最大存储容量 |
8 TB |
| 支持的硬盘数量 |
8 |
能量控制
| 电源供应数量 |
1 |
| 电源类型 |
AC/DC |
| 电源 |
460 W |
内存参数
| 内存布局 |
1 x 4 GB |
| 内存时钟速度 |
1066 MHz |
| 错误更正代码 |
Y |
| 内存类型 |
DDR3-SDRAM |
| 最大内部存储 |
192 GB |
| 内存插槽数量 |
18 x DIMM |
| 内置存储器 |
4 GB |
处理器的特殊功能
| 英特尔®64 |
Y |
| 英特尔® 内线™ |
N |
| 英特尔®快速同步视频技术 |
N |
| Processor ARK ID |
52581 |
| 英特尔®可信执行技术 |
Y |
| 英特尔® Flex内存访问 |
N |
| 英特尔® 快速内存访问 |
N |
| 英特尔®快速存储技术 |
N |
| 英特尔®Turbo Boost技术 |
Y |
| 英特尔® 增强暂停状态 |
Y |
| 英特尔®超线程技术 |
Y |
| 英特尔® 防盗技术 |
N |
| 英特尔®直接输入/输出硬件辅助虚拟化技术 (Intel® VT-d) |
Y |
| 英特尔® 双显示功能技术 |
N |
| 英特尔® 清晰视频技术 |
N |
| 英特尔®清晰视频高清技术 |
N |
| 英特尔®无线显示(WiDi)技术 |
N |
| 英特尔®基于需求开关 |
Y |
| 增强型英特尔®SpeedStep动态节能技术 |
Y |
| 英特尔® FDI技术 |
N |
| 英特尔®VT-x的扩展页表（EPT） |
Y |
| 英特尔®vPro™ 技术 |
N |
| 英特尔®MID清晰视频技术 |
N |
| 英特尔® 我的WiFi技术 |
N |
处理器
| 无冲突处理器 |
N |
| 处理器支持内存带宽（最大值） |
32 GB/s |
| 处理器高速缓存类型 |
Smart Cache |
| 处理器代码 |
SLBZ8 |
| 实体位址扩充（PAE） |
40 bit |
| 热监测技术 |
N |
| 执行禁止位 |
Y |
| QPI链接数量 |
2 |
| 处理器加速频率 |
2.93 GHz |
| 处理器高速缓存 |
12 MB |
| 处理器安装数量 |
1 |
| 核心的处理器数量 |
6 |
| SMP（适用于表面安装的封装形式）处理器的最大数量 |
2 |
| 散热设计功耗 (TDP) |
80 W |
| 总线频率 |
19 |
| 处理器光刻 |
32 nm |
| 处理器封装尺寸 |
42.5 mm |
| 步进 |
B1 |
| 处理器运行模式 |
64-bit |
| 可选用的嵌入式选项 |
N |
| FSB奇偶校验 |
N |
| 处理器前端汇流总线 |
1333 MHz |
| 总线类型 |
QPI |
| 支持指令集 |
SSE4.2 |
| 处理器支持 ECC 功能 |
Y |
| 外壳温度 |
76.2 °C |
| 处理器支持最大内存 |
288 GB |
| 处理器频率 |
2.53 GHz |
联网
| 局域网控制器 |
Broadcom BCM5709S |
| 网路唤醒功能 |
Y |
| 网路功能 |
Gigabit Ethernet |
其他功能
| 图形适配器系列 |
Matrox |
| Mac兼容性 |
N |
| 磁碟阵列控制器 |
LSI 1068 |
认证标准
| 遵守工业标准 |
IEEE 802.3, IEEE 802.3u, IEEE 802.3ab |
| 能源之星认证 |
Y |
另外
| InTru™3D技术 |
N |
| 主板晶片 |
Intel 5520 |
| 英特尔®AES新指令 |
Y |
| 以太网连接器 |
Y |
| 系统总线 |
5.86 GT/s |
| 图形适配器 |
G200eV |
| 以太网路(RJ-45)连接接口数量 |
2 |
x3550 M3, Intel Xeon E5649 (12M Cache, 2.53 GHz, 5.86 GT/s Intel QPI), 4GB DDR3, 8 x 2.5" SAS/SATA HDD, Hot-Swap, 2 x RJ-45, Gigabit Ethernet, 4 x USB 2.0, Rack/1U
Highlights
- Get higher performance per watt for greater cost efficiency.
- Simplify management and serviceability with flexible design.
- Maintain availability and lower risk through a resilient architecture.
Innovative technology in slim package
The IBM System x3550 M3 builds on the latest Intel ® Xeon® processor technology with extreme processing power and superior energy-management and cooling features. With twice the performance of previous generations and a flexible, energy-smart design that integrates low-wattage components, the x3550 M3 can help you meet demanding workloads at a lower cost per watt.
Simplifying management and serviceability
The x3550 M3 offers a flexible, scalable design and simple upgrade path from four to eight hard disk drives. Comprehensive systems management tools such as advanced diagnostics and the ability to control resources from a single point make it easy to deploy, integrate, service and manage.
Product features
- Power-optimized performance that leverages the speed of new Intel processors with more capacity and memory.
- Innovative, energy-smart 1U design to help lower operational costs.
- Energy-efficient design with UDIMMs, 40 W processing and UEFI BIOS.
- Better serviceability with a highly scalable, flexible design that is easy to deploy, integrate, service and manage.
- Easier risk management with resilient architectures and virtualized environments.
Hardware summary
- 1U chassis.
- Up to two 3.46 GHz six-core (3.60 GHz four-core) Intel Xeon 5600 series processors with QuickPath Interconnect technology, up to 1333 MHz memory access speed.
- Up to 192 GB RDIMMs or 48 GB UDIMMs high-performance, new generation DDR-3 memory.
- Internal storage flexibility with up to eight 2.5" hot-swap SAS/SATA HDDs or SSDs.
- Up to 2 PCIe slots.
- Low 675 W design and up to 94% efficient power supplies, six cooling fan modules, new UEFI BIOS, altimeter monitored by Integrated Management Module and IBM Systems Director Active Energy Manager™.
- NEBS 1/ETSI equivalent compliance for both AC and DC power supply (model dependent).
- Compliant with 80-PLUS® and ENERGY STAR® energy-efficiency standards (model dependent).
- VMware ESXi embedded hypervisor support with optional 2 GB USB key for virtualization.
