处理器
支持指令集 |
SSE4.2 |
处理器支持 ECC 功能 |
Y |
外壳温度 |
76.2 °C |
处理器运行模式 |
64-bit |
可选用的嵌入式选项 |
N |
FSB奇偶校验 |
N |
处理器前端汇流总线 |
1333 MHz |
无冲突处理器 |
N |
处理器支持内存带宽(最大值) |
32 GB/s |
处理器高速缓存类型 |
Smart Cache |
处理器代码 |
SLBZ8 |
实体位址扩充(PAE) |
40 bit |
热监测技术 |
N |
执行禁止位 |
Y |
QPI链接数量 |
2 |
处理器加速频率 |
2.93 GHz |
处理器高速缓存 |
12 MB |
处理器安装数量 |
1 |
核心的处理器数量 |
6 |
散热设计功耗 (TDP) |
80 W |
总线频率 |
19 |
处理器光刻 |
32 nm |
处理器封装尺寸 |
42.5 mm |
SMP(适用于表面安装的封装形式)处理器的最大数量 |
2 |
处理器支持最大内存 |
288 GB |
处理器频率 |
2.53 GHz |
步进 |
B1 |
总线类型 |
QPI |
处理器的特殊功能
英特尔®清晰视频高清技术 |
N |
英特尔®无线显示(WiDi)技术 |
N |
英特尔®基于需求开关 |
Y |
增强型英特尔®SpeedStep动态节能技术 |
Y |
英特尔® FDI技术 |
N |
英特尔®MID清晰视频技术 |
N |
英特尔® 我的WiFi技术 |
N |
英特尔® 增强暂停状态 |
Y |
英特尔®超线程技术 |
Y |
英特尔® 防盗技术 |
N |
英特尔®直接输入/输出硬件辅助虚拟化技术 (Intel® VT-d) |
Y |
英特尔® 双显示功能技术 |
N |
英特尔® 清晰视频技术 |
N |
英特尔®64 |
Y |
英特尔® 内线™ |
N |
英特尔®快速同步视频技术 |
N |
Processor ARK ID |
52581 |
英特尔®可信执行技术 |
Y |
英特尔® Flex内存访问 |
N |
英特尔® 快速内存访问 |
N |
英特尔®快速存储技术 |
N |
英特尔®Turbo Boost技术 |
Y |
英特尔®VT-x的扩展页表(EPT) |
Y |
英特尔®vPro™ 技术 |
N |
存储介质
RAID支持 |
Y |
最大存储容量 |
16 TB |
支持的硬盘数量 |
16 |
热插拔 |
Y |
硬盘尺寸 |
2.5 " |
内存参数
最大内部存储 |
192 GB |
内存插槽数量 |
18 x DIMM |
内存类型 |
DDR3-SDRAM |
内存布局 |
1 x 4 GB |
内存时钟速度 |
1333 MHz |
错误更正代码 |
Y |
内置存储器 |
4 GB |
其他功能
Mac兼容性 |
N |
磁碟阵列控制器 |
LSI 1068 |
图形适配器系列 |
Matrox |
能量控制
电源供应数量 |
2 |
电源类型 |
AC/DC |
电源 |
460 W |
联网
局域网控制器 |
Broadcom BCM5709S |
网路唤醒功能 |
Y |
网路功能 |
Gigabit Ethernet |
认证标准
遵守工业标准 |
IEEE 802.3, IEEE 802.3u, IEEE 802.3ab |
能源之星认证 |
Y |
另外
英特尔®AES新指令 |
Y |
主板晶片 |
Intel 5520 |
InTru™3D技术 |
N |
以太网路(RJ-45)连接接口数量 |
2 |
以太网连接器 |
Y |
系统总线 |
5.86 GT/s |
图形适配器 |
G200eV |
x3650 M3, Intel Xeon E5649 (12M Cache, 2.53 GHz, 5.86 GT/s Intel QPI), 4GB DDR3, 16 x 2.5" SAS/SATA/SSD HDD, Hot-Swap, 2 x RJ-45, Gigabit Ethernet, 4 x USB 2.0, Rack/2U
Highlights:
- Improve cost-effectiveness with higher performance per watt.
- Simplify management and serviceability with flexible design.
- Manage risk with resilient architectures and virtualized environments.
Packed with innovation
The IBM System x3650 M3 provides outstanding performance for your mission-critical applications. Its energy-efficient design supports more cores, memory and data capacity in a scalable 2U package that’s easy to service and manage. With more computing power per watt and the latest Intel® Xeon® processors, you can reduce costs while maintaining speed and availability.
Simplify management and serviceability
The x3650 M3 offers a flexible, scalable design and simple upgrade path to 16 HDDs or SSDs, and 192 GB of memory. Comprehensive systems management tools such as advanced diagnostics, a cable management arm and the ability to control resources from a single point make it easy to deploy, integrate, service and manage.
Product features
- Power-optimized performance that leverages the speed of new Intel processors with more capacity and memory.
- Innovative, energy-smart 2U design to help lower operational costs.
- Energy-efficient design with UDIMMs, 40 W processing and UEFI BIOS.
- Better serviceability with a highly scalable, flexible design that is easy to deploy, integrate, service and manage.
- Easier risk management with resilient architectures and virtualized environments.
Hardware summary
- 2U chassis.
- Up to two 3.46 GHz six-core (3.60 GHz four-core) Intel Xeon 5600 series processors with QuickPath Interconnect technology, up to 1333 MHz memory access speed.
- Up to 192 GB RDIMMs or 48 GB UDIMMs high-performance, new-generation DDR-3 memory.
- Internal storage flexibility with up to sixteen 2.5" hot-swap SAS/SATA HDDs or SSDs.
- Up to four PCIe slots.
- Low 675 W design and up to 94% efficient power supplies, six cooling fan modules, new UEFI BIOS, altimeter monitored by Integrated Management Module and IBM Systems Director Active Energy Manager™.
- NEBS 1/ETSI equivalent compliance for both AC and DC power supplies (model dependent).
- Compliance with 80-PLUS® and ENERGY STAR® energy-efficiency standards (model dependent).
- VMware ESXi embedded hypervisor support with optional 2 GB USB key for virtualization.