性能
| 噪音水平（高速） |
23 dB |
| 转速（最小） |
800 RPM |
| 转速（最大） |
2200 RPM |
| 类型 |
Cooler |
| 适用于 |
Processor |
| 风扇数量 |
1 fan(s) |
| 风扇直径 |
120 mm |
| 处理器插座 |
Socket AM3, Socket AM3+, Socket AM2+, Socket FM2, Socket AM2, Socket FM2+, Socket FM1 |
| 散热管数量 |
4 |
| 散热管直径 |
6 mm |
| 风扇厚度 |
25 mm |
| 最大气流 |
112 cfm |
| 最小气流 |
40.7 cfm |
| 热阻 |
0.095 °C/W |
| 气流 |
213.1 m³/h |
| 最低空气压力 |
0.83 mmH2O |
| 最大空气压力 |
3.64 mmH2O |
| 噪音水平（低速） |
8 dB |
重量和尺寸
| 风扇尺寸（宽×深×高） |
120 x 120 x 25 mm |
| 散热器重量 |
460 g |
| 散热片尺寸（宽x深x高） |
138 x 60 x 160 mm |
120mm, 2200 r.p.m., 112 CFM, 213.1 m3/h, 3.64 mmH2O, 23dB
The CPU cooler LV12 is the result of extensive research and development. The engineers designed a slim and compact heat sink which avoids compatibility issues with higher RAM modules while maintaining a high performance capability. Therefore, LEPA relies on a new technique for efficient air stream conduction: Small air vents improve the air circulation inside the heat sink and increase the heat dissipation rate. The heat pipes rest directly on the CPU so that hot spots can be eliminated quickly. Due to these techniques, LEPA engineers were able to lower down the thermal resistance of the cooler to just 0.095°C/W.
LEPA includes a high-quality PWM fan with the durable “Barometric Oil-less” (BOL) bearing. Thanks to the application of self-lubricating materials, the patented technology allows for a consistently silent operation with 160,000 hours MTBF. Apart from that, you can detach the fan blades in order to clean them from dust and avoid a drop in performance. The 12cm fan comes with an automatic PWM control and three RPM modes. That way, you can adjust the RPM setting according to your individual system requirements: Silence Mode (800 – 1,500 RPM), Performance Mode (800 – 1,800 RPM) and Overclocking Mode (800 – 2,200 RPM).
The stylish matt black coating is not only upgrading the cooler optically, but also protects it from corrosion. LEPA applies a high-tech finish (“Super Thermal Conductive Coating”) which makes sure that it does not affect the thermal conductivity and cooling performance of the cooler. The quick and user-friendly mounting system supports all current Intel® and AMD® platforms.
New Louver Heat Sink Structure
The Louver fins with small openings ensure best possible air conduction and a quick and efficient heat transfer within the heat sink. Due to the U-Shape air stream conduction, the cooler can absorb more heat than ordinary solutions.
Superior Contact
H.D.T. (Heatpipe Direct Touch) Technology ensures rapid thermal conduction and eliminates CPU hot spots.
Compatibility
Slim heat sink tower design increases the RAM installation flexibility.
Higher Durability
S.N.T.C (Super Nano Thermal Conductive) coating protects the heat sink from oxidation while maintaining an excellent heat transfer efficiency and extending the life expectancy of the cooler.
Patented APS control
The intelligent APS (Adjustable Peak Speed) control of the fan provides 3 peak RPM settings to reach the optimal cooling performance for the individual system configuration.
BOL Bearing
Barometric Oilless (BOL) Bearing for long life span and silent spinning.
High Performance & Silent Operation
The sophisticated fin gap calculation ensures the perfect balance between fan speed and heat transfer efficiency.
Easy Installation
The user-friendly all-in-one bracket supports all latest Intel® and AMD® sockets.
