内存参数
内置存储器 |
6 GB |
内存类型 |
DDR3 |
内存时钟速度 |
2133 MHz |
内存格式因素 |
240-pin DIMM |
内存电压 |
1.65 V |
CAS响应时间 |
9 |
內存佈局(模塊 x 內存大小) |
3 x 2 GB |
6GB DDR3 PC3-17000 TC Kit
The Flex EX memory series features breakneck speeds demanded by enthusiasts in an updated compact form factor to maximize memory configurations on your motherboard. These premium high-density modules operate at incredibly fast DDR3 speeds to run the latest memory-intensive games and applications, and offer enthusiasts the thermal management necessary for the stability and performance on high-end gaming and overclocking systems.
The OCZ Flex EX heat management solution enables high-frequency memory to operate within an optimal balance of extreme speeds and low latencies without the high temperatures that inhibit or damage the module. Each Flex EX memory module features this breakthrough thermal management technology from OCZ, combining an effective new heatspreader design with integrated liquid injection system and dedicated channels directly over the module’s Ics. The new improved thinner form factor of the Flex EX heatsink allows multiple kits to be installed on most motherboards to maximize your RAM capabilities. This latest series was engineered with a unique “flexible” design to give enthusiasts the option to run the modules passively or water cooled via the array of aluminum fins, and the concurrent use of both options promotes maximum heat dissipation.
Developed for enthusiasts and early-adopters, the low voltage OCZ Triple Channel solutions are the choice counterparts for leading-edge performance that won’t inhibit the functionality of Core i7 CPUs. In addition, modules are tested in matched triplets ensuring superior compatibility.