重量和尺寸
| 风扇尺寸（宽×深×高） |
120 x 120 x 25 mm |
性能
| 最大气流 |
79 cfm |
| 最小气流 |
12.93 cfm |
| 气流 |
113.34 m³/h |
| 最低空气压力 |
0.07 mmH2O |
| 最大空气压力 |
1.56 mmH2O |
| 噪音水平（低速） |
4 dB |
| 噪音水平（高速） |
28 dB |
| 转速（最小） |
300 RPM |
| 转速（最大） |
1400 RPM |
| 类型 |
Cooler |
| 适用于 |
Processor |
| 风扇数量 |
1 fan(s) |
| 风扇直径 |
120 mm |
| 处理器插座 |
Socket AM3, Socket AM3+, Socket AM2+, Socket FM2, Socket AM2, LGA 1151 (Socket H4), Socket FM2+, Socket FM1 |
| 散热管数量 |
5 |
| 散热管直径 |
8 mm |
| 风扇厚度 |
25 mm |
300-1400 RPM, 4 - 28 dBA, 130 x 125 x 149 mm, 720 g
Designed to deliver uncompromised performance with compact dimensions and maximum compatibility, the Kabuto 3 expands the Scythe cooler portfolio with a new top-flow model. Based on the experience with its predecessor and extensive customer feedback, the main focus points during development were an improved cooling performance and user experience as well as noise reduction. Made from nickel-plated copper, the finely polished base plate is carefully manufactured to exactly fit the heatpipes. This improves heat transfer and the overall cooling performance significantly. A 120 mm PWM fan from the proven and reliable GlideStream series is included. As known from its predecessor, the top-flow design also supports the cooling of motherboard components such as the chipset, VRMs, and memory modules. The Easy Clip Mounting System allows simple, safe and fast installation.
Hybrid Heatpipes
Kabuto 3 uses a hybrid system which consists of two 6 mm and three 8 mm heatpipes. The nickel-plated copper base-plate is carefully manufactured to exactly fit the heatpipes, resulting in an improved heat transfer and an overall better performance.
Top-Flow-Design
The downward airflow ventilates not only the heatsink fins of Kabuto 3, but also cools VRMs, memory modules, as well as other components surrounding the processor socket. This helps to prevent heat accumulation and increases the mainboards lifetime.
Increased compatibility
Special design as well as the improved arrangement and shape of the heatpipes of Kabuto 3 allows mounting even in compact cases. The free space between motherboard and heatsink provides excellent compatibility to large memory modules or VRM coolers.
