Scythe Thermal Elixer 2

5 g, 0.013 K-in² / W, 1,5 KV / mm The new Scythe Thermal Elixer 2 provides excellent heat transfer between the processor and heat sink without compromising the application. High-quality ingredients in combination with the Pure Aluminum Particle Hybrid technology reduce the thermal resistance significantly and allow a convenient and controlled application. It has an excellent long-term stability and has no electrically conductivity under normal use. The applied thermal grease is ready to be used right away and no "burn-in" time is required.

<b>Excellent Cooling Performance</b>
With the focus on the PC sector Pure Aluminum Particle Hybrid Technology is used to optimize the heat transfer between CPU and heat sink. The Thermal Elixer 2 has a very high thermal conductivity and low thermal resistance. A special additive composition provides an excellent long-term stability and extremely low dry-out characteristics.

<b>Easy to Apply</b>
The consistency allows easy and economic application. Even removing the applied thermal grease is easily. Furthermore, it has a very low dielectric constant / high dielectric strength and no corrosive properties. There is no risk of short circuit, even if the thermal compound covers electrically conductive components.

<b>No "burn-in" time</b>
The Thermal Elixer 2 reaches its maximum potential immediately after applying. It does not require large time riods to provide maximum cooling performance.