Universal Retention Kit 3, Secure mounting for High-End CPU Cooler
<b>Scythe Corporation</b>
, a renowned cooling manufacturer, today announced the release of its third version of the Universal Retention Kit. This enhanced version comes with several improvements and wide multi-socket compatibility for both AMD and Intel sockets. The list of compatible sockets contains Intel Socket T / LGA775, LGA1156 LGA1366 and the brand-new socket LGA1155. It furthermore supports the AMD Sockets 754, 939, AM2, AM2+, AM3 and 940. Universal Retention Kit 3 is once again based on a backplate mounting system and allows firm contact pressure as well as secure mounting of even big and heavy CPU Coolers.
Commonly supplied retention bracket of AMD Mainboards are made of plastic which has a downside of giving risk of breaking when using with an on-market High-End CPU Cooler. This problem doesn’t accrue with the supplied retention bracket of the Universal Retention Kit 3 which is made of solid steel and thereby provides the necessary sturdiness even for big High-End CPU Coolers. For Intel architecture this kit allows pushpin mounting to be converted to backplate mounting, thereby providing high mechanical stability hence also providing the necessary sturdiness even for big High-End CPU Coolers with a pushpin solution. In order to ease the detachment process of Push-Pins, a convenient Push-Pin Removal Tool is supplied along in the accessory.
Scythe Universal Retention Kit 3 can be further used in case of loss of mounting brackets, as well as a replacement backplate for your Scythe “Flip Mount Super Backplate” mounted Coolers.
