Supermicro Intel P3700 400GB NVMe

Supermicro Intel P3700 400GB NVMe

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技术特点

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技术细节

操作冲击 50 G
运行性震动 2.17 G
状态 4
最大作业高度 3048 m
最大非工作海拔高度 12192 m
顺序写入 1080 MB/s
顺序读取 2700 MB/s
市场细分 SRV
产品简介网址 http://www.intel.com/content/dam/www/public/us/en/documents/product-briefs/intel-ssd-dc-family-for-pcie-brief.pdf
SSD 撞击(操作和不操作)冲击 50 G Trapezoidal, 170 in/s
SSD的功耗(活动) 12W (write), 9W (read)
SSD的功耗(空闲) 4W
SSD接口 PCIe NVMe 3.0 x4
SSD 耐用性等级认定 7.3 PBW (JEDEC Workload), 10 DWPD
SSD重量 185gm
Born on date Q2'14
硬盘容量 400 GB
产品名称 Intel SSD DC P3700 Series (400GB, 1/2 Height PCIe 3.0, 20nm, MLC)
非运行性振动 3.13 G

其他功能

內置式 Y
无法纠正的位错率(UBER) less than 1 sector per 1e17 bits read

性能

固态磁盘驱动器的容量 400 GB
光刻技术 20 nm
读取速度 2700 MB/s
写入速度 1080 MB/s
错误更正代码 Y
无线局域网连接 N
随机写入(100%量程) 75000 IOPS
随机读取(100%量程) 450000 IOPS
内存类型 MLC
英特尔®高耐用性技术(HET) Y
顺序性书写 Y
PCI Express接口数据线 x4
随机写入(4KB) 75000 IOPS
随机读取(4KB) 450000 IOPS
延时(读取) 20 µs
延时(写入) 20 µs
增强功率损耗的数据保护技术 Y
SSD温度监控 Y
耐久等级(5年) 0.3 GB/day
端到端数据保护 Y
随机读取(8KB) 275000 IOPS
随机写入(8KB) 32000 IOPS
固态磁盘驱动器 接口 PCI Express

能量控制

功耗( idle) 4 W
功耗(读) 9 W
功耗(写) 12 W

设计

SSD 外形尺寸 PCI Experess
产品系列 Data center SSD
产品系列 Intel DC P3700
产品代号 Fultondale
400GB, NAND 20nm MLC, PCIe NVMe 3.0 x4, 2700 MB/s, 1080 MB/s, CEM2.0. NVMe (Non-Volatile Memory Express) is a scalable, high performance CPU PCI-E Gen3 direct connnect to NVMe devices, designed for Client and Enterprise server systems using SSDs technology, that was developed to reduce latency and provide faster CPU to data storage device performance.

By deploying Supermicro NVMe, customers can benefit from reduced latency, increased Input/Output operations per second (IOPS), and lower power consumption. This means that customers' Supermicro solutions can perform more work in less time, translating into lower costs and increased revenues. Thus the ROI benefits for customers from NVMe enabled Supermicro servers is immediate and substantial.

The Supermicro server solutions with NVMe support are targeted at HPC, Oil and Gas, 3D modeling and Graphical design workstation, HFT, SQL Database, Search Engine, High Security Encryption datacenter, VDI, Aerospace and Automobile design center, Cluster and Supercomputer applications; in Cloud, Virtualization, and Enterprise environments.

- Large throughput gains (6x)
- Substantial latency improvements (7x)
- Shared common backplane improves flexibility of drive choice
- Improved serviceability vs. PCI-E Flash cards (hot-swap)
- Improved power efficiency
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