内存参数
无错误检测和更正 |
Y |
支持的DIMM大小 |
16GB, 1GB, 2GB, 32GB, 4GB, 64GB, 8GB |
内存电压 |
1.5, 1.35 V |
支持UDIMM模组容量 |
1GB, 2GB, 4GB, 8GB |
最大UDIMM内存 |
128 GB |
最大RDIMM内存 |
512 GB |
最大 LRDIMM 内存 |
1000 GB |
可支持内存时钟速度 |
800, 1066, 1333, 1600, 1866 MHz |
支持UDIMM时钟速度 |
800, 1066, 1333, 1600 MHz |
错误更正代码 |
Y |
DIMM插槽数量 |
16 |
最大内部存储 |
1000 GB |
支持的内存类型 |
DDR3-SDRAM |
联网
局域网控制器 |
Intel I350, Realtek RTL8201N |
以太网接口类型 |
Gigabit Ethernet |
无线局域网连接 |
N |
扩展槽
PCI Express X16(Gen 3.x)插槽 |
2 |
PCI Express X 4(Gen 2.x)插槽 |
1 |
PCI Express X 8(Gen 3.x)插槽 |
3 |
内置输入/输出系统
SATA III连接器数量 |
2 |
SATA II连接器数量 |
8 |
串行端口接头连接器 |
1 |
TPM(可信任安全平台模组)接口 |
Y |
USB 2.0接口 |
2 |
处理器
处理器生产厂商 |
Intel |
可支持处理器数量 |
2 |
英特尔® 至强® 系列 |
E5-2600 |
支持QPI |
8 GT/s |
背板输出端口
耳机输出端口 |
1 |
麦克风/音频输入插孔 |
Y |
IPMI LAN端口(RJ-45) |
Y |
设计
组件应用 |
Server |
主板元件 |
Extended ATX |
基本輸出輸入系統/BIOS
ACPI的版本 |
5.0 |
基本输入输出系统类型 |
UEFI AMI |
存储控制器
硬盘接口 |
Serial ATA II, Serial ATA III |
另外
主板晶片 |
Intel C602 |
以太网连接器 |
Y |
以太网路(RJ-45)连接接口数量 |
2 |
2 x LGA 2011, Intel C602, max. 1TB DDR3 ECC 1866/1600/1333/1066/800MHz ECC SDRAM, 2 x Gigabit LAN, 2x SATA III, 8x SATA II, Enhanced Extended ATX, Bulk Pack
Supermicro's New Generation X9 Serverboards offer the highest levels of performance, efficiency and scalability in the industry. The Supermicro X9 Serverboards are available in a variety of architectures including Twin and new Fat Twin, GPU Supercomputer, Data Center Optimized, SuperServer® Advantage, I/O Optimized, SuperWorkstation, and SuperStorage Solutions. These Serverboards offers numerous advantages including up to 1.5TB DDR3 (up to 1866MHz) memory in 24 DIMM slots, SATA 3.0 and SAS 3.0 (12Gbps) HDD support, ConnectX FDR/QDR InfiniBand ports, dual 10 Gigabit Ethernet, Quad Ethernet LAN, PCI-E 3.0 technology, LSI® 2308 controller with software RAID and LSI® 2208 controller with hardware RAID, IPMI 2.0, and Intel® Xeon® processor E5-2600 or E5-2600 v2 family for highest performance. With this New Generation X9 Serverboard Platform Supermicro offers the most extensive selection of solutions for Data Center, Enterprise IT, Cloud Computing, Graphics, Technical Computing, and HPC environments.