内存参数
| 可支持内存时钟速度 |
800, 1066, 1333, 1600 MHz |
| 无错误检测和更正 |
Y |
| 错误更正代码 |
Y |
| 支持的内存类型 |
DDR3-SDRAM |
| 内存电压 |
1.5, 1.35 V |
| 支持的DIMM大小 |
16GB, 1GB, 2GB, 32GB, 4GB, 8GB |
| 最大UDIMM内存 |
128 GB |
| 最大RDIMM内存 |
768 GB |
| 最大内部存储 |
768 GB |
背板输出端口
| 串口数量 |
1 |
| IPMI LAN端口（RJ-45） |
Y |
| VGA（D-SUB）端口数量 |
1 |
内置输入/输出系统
| 风扇电源接头 |
Y |
| TPM（可信任安全平台模组）接口 |
Y |
| SATA III连接器数量 |
2 |
| SATA II连接器数量 |
4 |
| USB 2.0接口 |
5 |
| 串行端口接头连接器 |
1 |
处理器
| 发热量 |
135 W |
| 可支持处理器数量 |
2 |
| 英特尔® 至强® 系列 |
E5-2600 |
| 支持QPI |
6.4, 7.2, 8 GT/s |
| 处理器生产厂商 |
Intel |
| 可支持的处理器的核心数量 |
4, 8, 6 |
扩展槽
| PCI Express x16 插槽 |
4 |
| PCI Express x8插槽 |
1 |
| PCI Express × 4插槽 |
1 |
| PCI Express插槽版本 |
3.0 |
联网
| 局域网控制器 |
Intel I350, Realtek RTL8201N |
| 以太网接口类型 |
Gigabit Ethernet |
| 无线局域网连接 |
N |
设计
| 主板元件 |
Extended ATX |
| 组件应用 |
Server |
基本輸出輸入系統/BIOS
| ACPI的版本 |
4.0 |
| 基本输入输出系统类型 |
AMI |
| BIOS内存大小 |
128 MB |
存储控制器
| 硬盘接口 |
Serial ATA II, Serial ATA III, Serial Attached SCSI (SAS) |
另外
| 主板晶片 |
Intel C606 |
| 以太网连接器 |
Y |
| 以太网路(RJ-45)连接接口数量 |
4 |
X9DR3-LN4F+ - EE-ATX, 768GB DDR3 24 DIMM slots, 2x SATA3, 4x SATA2, 8x SAS via C606, Intel i350 GbE (4 ports), Standard Retail Pack
Supermicro's New Generation X9 Serverboards offer the highest levels of performance, efficiency and scalability in the industry. The Supermicro X9 Serverboards are available in a variety of architectures including Twin and new Fat Twin, GPU Supercomputer, Data Center Optimized, SuperServer® Advantage, I/O Optimized, SuperWorkstation, and SuperStorage Solutions. These Serverboards offers numerous advantages including up to 768GB of Reg. ECC DDR3-1600MHz memory in 24 DIMM slots, SATA 3.0 and SAS 2.0 (6Gb/s) HDD support, ConnectX FDR/QDR InfiniBand ports, dual 10 Gigabit Ethernet, Quad Ethernet LAN, PCI-E 3.0 technology, LSI® 2308 controller with software RAID and LSI® 2208 controller with hardware RAID, IPMI 2.0, and Intel® Xeon® processor E5-2600 family for highest performance. With this New Generation X9 Serverboard Platform Supermicro offers the most extensive selection of solutions for Data Center, Enterprise IT, Cloud Computing, Graphics, Technical Computing, and HPC environments.
