内存参数
| 支持的内存类型 |
DDR3-SDRAM |
| 支持RDIMM模块的容量 |
8GB, 4GB, 2GB |
| 内存插槽类型 |
SO-DIMM |
| 内存电压 |
1.5, 1.35 V |
| 错误更正代码 |
Y |
| 内置存储器 |
16 GB |
基本輸出輸入系統/BIOS
| BIOS内存大小 |
128 MB |
| 基本输入输出系统类型 |
AMI |
背板输出端口
| DisplayPort 数量 |
1 |
| HDMI端口数量 |
1 |
| DVI-I接口数量 |
1 |
| USB 3.0（第 1代3.1）Type-A 端口数量 |
4 |
扩展槽
| PCI Express X16（Gen 3.x）插槽 |
1 |
处理器
| 英特尔®酷睿™ i3/ i5 / i7 系列 |
i7-3xxx |
另外
| 主板晶片 |
Intel QM77 Express |
| 以太网路(RJ-45)连接接口数量 |
4 |
| 以太网连接器 |
Y |
Embedded 3rd Generation Intel Core i7-3555LE Mobile ECC, Intel QM77, 16GB ECC DDR3 1600/1333MHz, 2x SO-DIMMs, Intel Integrated Graphics HD 4000, Retail Pack
<b>QM77 Express chipset / Socket FCBGA1023 Boards</b>
Supermicro X9SPV-F and X9SPV-LN4F motherboards based on the Mobile Intel QM77 Express chipset support Intel's 3rd Generation Core i7/i5/i3 processors. The compact mini-ITX motherboards are ideal for high-performance, low-power embedded applications, with features that include support for 16GB DDR3 Memory, SATA 3 & SATA 2 HDD/SSD storage with RAID support, 4x Gigabit Ethernet LAN Ports, PCI-E 3.0 x16 slot for added Graphics, Networking or I/O expansion. Compared to the previous generation architecture, this solution delivers 15% more processing performance, up to 50% more 3D graphics performance supporting the latest graphic APIs - DX11, OpenCL 1.1 and OpenGL 3.1 and new features such as Intel® Smart Response Technology enabling increased storage I/O performance with SSD caching.
