性能
| 类型 |
Radiator |
| 适用于 |
Motherboard |
| 处理器插座 |
Socket AM3, Socket AM3+, Socket AM2+, Socket FM2, Socket AM2, LGA 2011-v3 (Socket R), Socket FM1 |
| 散热管数量 |
8 |
| 散热管直径 |
6 mm |
L150mm, 1120g, 35 pcs
The HR-22 is Thermalright’s super flagship cooler and accumulation of over 10 years of thermal
innovation and technology. Design based on our new Directed Passive Airflow System, the HR-22 from
the ground up was designed for 0 CPU Fan passive cooling.
What is DPAS?
DPAS is a comprehensive system of optimizations that takes total advantage of the natural airflow current within an enclosed PC-case. It is the accumulation of heatsink technology that works together to orchestrate PC-case airflow for maximum passive CPU heat dissipation.
Our Directed Passive Airflow System contains specific design guidelines for:
- Heatsink Fin Gap
- Heatsink Fin Shape and Patented Fin Through Holes
- Heatsink Structural Shape and X/Y Axis Displacement
- Thermalright Proprietary Airflow Tunnel Add-on Kit
With our Directed Passive Airflow system, the HR-22 can cool down the latest high-end AMD and Intel
systems purely on case airflow generated by the system fans. And in fact letting PC users (sorry Mac!)
eliminate the need for one of the noisiest component in your PC chassis (CPU FAN)! You think other
sound/noise/silent optimized coolers have a chance? Try beating 0dBA!
Axis Displacement
Heatsink Body Axis Displacement, no Interference with PCIE Slot 1 and RAM Slots on ATX or Micro ATX Boards.
Aerodynamic Fin Design
HR Series Patent Through Holes, with Advanced Radial Alignment, for enhanced directed airflow and extra Heat Dissipation Surface Area.
Airflow Tunnel
Proprietary Airflow Tunnel add-on kit for a 5-10% performance increase in Passive Cooling mode.
Area of Effect XL
40% Larger Heat Dissipation Surface Area than it's predecessor, and largest Heat Dissipation Surface Area to date among Thermalright Heatsinks.
8X Premium Copper Heatpipes
Eight 6mm Fully Sintered Copper Heatpipes, ideal for high TDP cooling usage.
