技术细节
| 支持的耗材厚度 |
1.75 mm |
| 打印头数量 |
2 |
| 打印平台最高温度 |
270 °C |
| 图层厚度（最小） |
0.05 mm |
| 图层厚度（最大） |
0.2 mm |
| 喷嘴/吸嘴宽度 |
0.35 mm |
端口 & 界面
| 集成读卡器 |
Y |
| USB端口 |
Y |
| USB版本 |
2.0 |
| 兼容性内存条 |
SD |
FFF, 0.05 - 0.2mm, 30 - 300 mm/s, PLA ABS
Printing:
- print technology: Fused Filament Fabrication (FFF)
- layer resolution: standard: 0.1 mm (maximum: 0.2 mm - minimum: 0.05 mm)
- build plate: 215 x 240 mm (8.46" x 9.45")
- build volume: 180 x 200 x 190 mm (7" x 7.8" x 7.5")
- print speed: 30 mm/s - 120 mm/s
- travel speed: 30 mm/s - 300 mm/s
- build plate surface: Removable layer of BuildTak™
- (consumable; also sold separately)
- filament diameter: 1.75 mm (accepts all filament spools with a mounting hole = 53 mm).
- Open filament policy.
- prints: PLA, ABS
- Testing with other materials in progress.
- nozzle 1&2 diameter: 0.35mm
- One nozzle supplied. Second nozzle optional.
- distance between nozzles: 23.7 mm
- Maximum nozzle operating temperature: 270 °C
Software:
- firmware: Modified Open Source Marlin 3D Printer
- Firmware - user upgradable
- software: Repetier - CuraEngine - Slic3r
- (RepRap compatible)
Hardware:
- dimensions: X Y Z 360 - 380 - 395 mm
- (14" x 15" x 15.5") (without filament spools)
- frame: Polycarbonate panels and fibre reinforced molded ABS parts
- weight: 10 kg
- average noise level during operation: 52 dBA (at 1 m)
- ambient operation temperature: max 25 °C
- storage temperature: - 10 °C to + 40 °C
Electrical:
- communication: USB 2.0 or SD card
- controller board: AVR ATmega2560 based
- Dual head and heated bed capable
- display: 4 x 20 char. blue LCD with white backlight
- AC input: 100 - 240 VAC 50-60Hz 150W max.
