XCPD TNN 300 Midi-Tower 350W Black computer case

TNN 300 - midi - tower CPU Heatpipes
Heat from the CPU is transferred to the heatsink plate through 6 heatpipes each 6 millimeters in diameter and a combined heat transfer capacity of 150 watts. The CPU Block Base is made of pure copper to ensure the highest cooling performance.

VGA Heatpipes
Heat from the VGA Card is transferred to the heatsink plate through 3 heatpipes each 6 millimeters in diameter and a combined heat transfer capacity of 75 watts.

Environment Friendly System
Large aluminum heatsink plates silently cool heat generating components, such as the CPU, VGA Chipset, and PSU through natural convection. It is virtually free of the need for mechanical maintenance, and is 100% recyclable.

Heat Transfer via Rear-mount Thermal Blocks
When the Rear-mount Thermal Blocks are installed on the back-side of the motherboard in line with the position of the FETs (Field Effect Transistor) and the Northbridge chipset, each can lower the FET temperature by 10 to 30°C (50 to 86°F) and the Northbridge chipset by 5 to 10°C (41 to 50°F).