性能
| 主板元件 |
ATX |
| 主板芯片组系列 |
Intel |
| 英特尔® 极限内存认证标准 （Intel® XMP) |
Y |
| PC健康监测 |
FAN, Temperature, Voltage |
| 组件应用 |
PC |
| 冷却方式 |
Active |
内存参数
| 可支持内存时钟速度 |
4500, 4300, 4400, 4200, 4266, 2133, 2400, 2600, 2666, 2800, 2933, 3000, 3200, 3300, 3333, 3400, 3466, 3600, 3666, 3733, 3800, 3866, 4000, 4133 MHz |
| 无错误检测和更正 |
Y |
| 无缓冲内存 |
Y |
| 支持的内存类型 |
DDR4-SDRAM |
| 内存通道支持 |
Dual |
| 内存插槽类型 |
DIMM |
| 內存插槽数量 |
4 |
| 最大内部存储 |
64 GB |
基本輸出輸入系統/BIOS
| 基本输入输出系统类型 |
UEFI AMI |
| ACPI的版本 |
5.0 |
内置输入/输出系统
| USB 2.0接口 |
2 |
| ATX电源接头 |
Y |
| TPM（可信任安全平台模组）接口 |
Y |
| USB 3.0（第 1代3.1）连接器 |
2 |
| SATA III连接器数量 |
10 |
| 周边（莫仕）电 源连接器（4针） |
1 |
| PS电源接口 （8针） |
Y |
| CPU风扇接口 |
Y |
| COM连接器数量 |
1 |
| 机箱风扇接头数量 |
4 |
| 前面板音频接头 |
Y |
| SATA Express 连接器数量 |
13 |
| 迅雷 ™ 连接头 (Thunderbolt™ headers) |
2 |
| M.2 (M) 插槽数量 |
3 |
扩展槽
| Mini PCI Express插槽 |
1 |
| PCI Express x1（Gen 2.x）插槽 |
1 |
| PCI Express X16（Gen 3.x）插槽 |
4 |
| PCI Express x1（Gen 3.x）插槽 |
1 |
背板输出端口
| USB3.1（第 2 代3.1）Type-A 端口数量 |
1 |
| USB3.1（第 2 代3.1）Type-C 端口数量 |
1 |
| PS/2连接埠数量 |
1 |
| 耳机输出端口 |
1 |
| S/PDIF输出接口 |
Y |
| 麦克风/音频输入插孔 |
Y |
| DisplayPort 数量 |
1 |
| USB 3.0（第 1代3.1）Type-A 端口数量 |
4 |
| HDMI端口数量 |
1 |
| DisplayPort版本 |
1.2 |
另外
| 主板晶片 |
Intel Z170 |
| 以太网连接器 |
Y |
| 以太网路(RJ-45)连接接口数量 |
1 |
Socket 1151, 4 x DDR4 DIMM, 2x128Mb AMI UEFI BIOS, Gigabit LAN, ATX
Designed for Overclockers!
Rules are meant to be broken. Limits don't exist. There is no spoon. Only motherboards that are custom made for overclockers.
XXL Aluminum Alloy Heatsink Design
Extra large aluminum alloy heat sinks that effectively take away heat from the MOSFET and chipset so that your whole system may perform more stable.
Premium 60A Power Choke
Compared to traditional chokes, ASRock’s premium 60A power chokes effectively make the saturation current up to three times better, thus providing enhanced and improved Vcore voltage to the motherboard.
Premium Memory Alloy Choke
Specifically designed for memory power delivery, these new alloy chokes feature a highly magnetic and heat resistant design, thus delivering more stable and reliable power to the motherboard and memory modules.
Dual-Stack MOSFET for CPU Power
Dual-Stack MOSFET (DSM) is another innovative MOSFETs design by ASRock. The silicon die area is increased by stacking two dies into one MOSFET. The larger the die area, the lower Rds(on). Compared to traditional discrete MOSFET, DSM with larger die area provides extreme lower Rds(on) 1.2 mΩ, so the power supply for the CPU Vcore is more efficient.
Combo Caps
A combination of 820uF and 100uF capacitors. Together these capacitors provide clearer, efficient and more responsive CPU Vcore power, and overclockers may achieve higher scores.
Nichicon 12K Platinum Caps
Supreme 12K platinum capacitors with lifespans of at least 12,000 hours. Compared to other counterparts on high-end motherboards that merely have lifespans of around 10,000 hours, ASRock applied Nichicon 12K Platinum Caps that offer 20% longer lifespans and provide more stability and reliability.
I/O Armor
A new designed protective cover for all of the crucial parts near the motherboard's rear I/O, so that they won't easily be damaged by static electricity.
Matte Black PCB
A new mysterious matte black and copper color scheme to match the prestigious components on ASRock's high-end 100 Series motherboards.
High Density Glass Fabric PCB
What you’ve never understood about your computer is that it is scared to death of water, H2O, humidity or whatever you’d like to name it. And even though you do not see the water, actually there may be lots of excessive moist in the air killing your motherboard silently and slowly. No, your motherboard doesn’t melt when in contact with water like the wicked witch of the west, but it dies of short circuit. Luckily, ASRock has a new High Density Glass Fabric PCB design that reduces the gaps between the PCB layers to protect the motherboard against electrical shorts caused by humidity.
18 Power Phase Design
The power phase design offers smooth power delivery to the CPU, unmatched overclocking capabilities, lower temperature for advanced gamers, and reinforced system stability for taking on all sorts of arduous computing tasks.
IR® Digital PWM
The onboard IR® Digital PWM controller delivers the most precise and stable power so that users may achieve optimal performance.
Hyper BCLK Engine
An additional external base clock generator which provides a wider range of frequencies and more precise clock waveforms. This helps overclockers to have more control over their systems.
Triple Ultra M.2 32 Gb/s (PCIe Gen3 x4 & SATA3)
The PCIe Gen3 x4 Ultra M.2 interface pushes data transfer speeds up to 32Gb/s. In addition, it also supports SATA3 6Gb/s M.2 modules, and is compatible with ASRock’s U.2 Kit for installing some of the world’s fastest U.2 PCIe Gen3 x4 SSDs.
XMP Switch
A convenient onboard switch for loading XMP profiles without having to enter the BIOS.
DDR4 OC
Originally an Easter egg, now the hidden option DDR4 OC may be summoned from the UEFI using certain memory modules, such as Samsung or Kingston DDR4 memory DIMMs. It unlocks the hidden potential of those memory modules and maximizes the performance!
UEFI EZ Mode
EZ mode is a dashboard which contains multiple readings of the system’s current status. You can check the most crucial information of your system, such as CPU speed, DRAM frequency, SATA information, fan speed, etc.
