性能
| 主板元件 |
Micro ATX |
| 音频系统 |
Realtek ALC892 |
| 组件应用 |
PC |
内存参数
| 可支持内存时钟速度 |
1066, 1333 MHz |
| 无错误检测和更正 |
Y |
| 内存通道支持 |
Dual |
| 支持的内存模块容量 |
1GB, 2GB, 4GB, 8GB |
| 內存插槽数量 |
4 |
| 最大内部存储 |
32 GB |
基本輸出輸入系統/BIOS
| BIOS内存大小 |
32 MB |
| ACPI的版本 |
2.0a |
处理器
| SMP（适用于表面安装的封装形式）处理器的最大数量 |
1 |
内置输入/输出系统
| USB 2.0接口 |
8 |
| S/PDIF输出端口 |
Y |
| 串列ATA连接器数量 |
6 |
| 并行ATA连接器 |
1 |
| ATX电源接头 |
Y |
| 风扇电源接头 |
Y |
| TPM（可信任安全平台模组）接口 |
Y |
| 火线接口数量 |
1 |
| SATA III连接器数量 |
2 |
| SATA II连接器数量 |
4 |
| PS电源接口 （8针） |
Y |
| CPU风扇接口 |
Y |
| COM连接器数量 |
1 |
| 机箱防盗接口 |
Y |
| 机箱风扇接头数量 |
1 |
| EATX电源接头数量 |
1 |
| 前面板音频接头 |
Y |
其他功能
| 控制器接口类型 |
Marvell 88SE6111 |
| 专用功能部件 |
MemOK! |
联网
| 网路唤醒功能 |
Y |
| 网路功能 |
Gigabit Ethernet |
图像
| 最大图形显示内存 |
1748 MB |
| 板载图形适配器 |
Y |
背板输出端口
| DVI-D接口数量 |
1 |
| PS/2连接埠数量 |
1 |
| IEEE 1394/Firewire(火线)端口数量 |
1 |
| S/PDIF输出接口 |
Y |
| 麦克风/音频输入插孔 |
Y |
| eSATA端口数量 |
1 |
| DisplayPort 数量 |
1 |
| USB 3.0（第 1代3.1）Type-A 端口数量 |
2 |
| HDMI端口数量 |
1 |
| VGA（D-SUB）端口数量 |
1 |
扩展槽
| PCI 插槽 |
1 |
| PCI Express x16 插槽 |
2 |
| PCI Express × 1插槽 |
1 |
| PCI Express插槽版本 |
2.0 |
另外
| 主板晶片 |
Intel H67 |
| 双dvi（互应式数字视频） |
Y |
| 以太网路(RJ-45)连接接口数量 |
1 |
P8H67-M EVO - Rev 3.0, Intel Socket 1155, Intel H67(B3), 4x DIMM DDR3, 1333/1066 MHz Non-ECC, Gigabit Ethernet, 2x SATA 6.0 Gb/s, 4x SATA 3.0 Gb/s, 12x USB 2.0/1.1, 2x USB 3.0/2.0, RAID 0,1,5,10
LGA1155 socket for Intel® Second Generation Core™ i7/ Core™ i5/ Core™ i3 Processors
This motherboard supports the latest Intel® second generation Core™ i7/Core™ i5/Core™ i3 processors in the LGA1155 package, with memory and PCI Express controllers integrated to support 2-channel (4 DIMM) DDR3 memory and 16 PCI Express 2.0 lanes. This provides great graphics performance. Intel® second generation Core™ i7/Core™ i5/Core™ i3 processors are among the most powerful and energy efficient CPUs in the world.
Intel® H67 Chipset
The Intel® H67 Express Chipset is the latest single-chipset design to support new socket 1155 Intel® second generation Core™ i7/Core™ i5/Core™ i3 processors. It provides improved performance by utilizing serial point-to-point links, allowing increased bandwidth and stability. Additionally, the H67 provides 2 SATA 6Gb/s and 4 SATA 3Gb/s ports for faster data retrieval at double the bandwidth of current bus systems. Moreover, Intel® H67 Express Chipset also supports iGPU function.
Quad-GPU CrossFireX Support!
Flexible Multi-GPU solutions, Your Weapon of Choice!
P8H67-M EVO brings multi-GPU configurations through CrossFireX. This motherboard features the powerful Intel® H67 platform, optimizing PCIe allocation in multiple GPU setups. Expect a brand new gaming sensation like you’ve never experienced before!
Latest Transfer Technology
USB 3.0 Support
Experience ultra-fast data transfers at 4.8Gbps with USB 3.0 - the latest connectivity standard. Built to connect easily with next-generation components and peripherals, USB 3.0 transfers data 10X faster and is also backward compatible with USB 2.0 components.
Native SATA 6Gb/s Support
The Intel® H67 Chipset natively supports next-generation Serial ATA (SATA) storage interface, this motherboard delivers up to 6.0 Gb/s data transfer rates. Additionally, get enhanced scalability, faster data retrieval, double the bandwidth of current bus systems.
EFI BIOS (EZ Mode)
Flexible & Easy BIOS Interface
The new ASUS EFI BIOS is an Extensible Firmware Interface that complies with uEFI architecture, offering a user-friendly interface that goes beyond traditional keyboard-only BIOS controls to enable more flexible and convenient mouse input. Users can easily navigate the new EFI BIOS with the same smoothness as their operating system. The exclusive EZ Mode displays frequently-accessed setup info, while the Advanced Mode is for experienced performance enthusiasts that demand far more intricate system settings.
Supports Hard Drives over 2.2TB
ASUS EFI BIOS natively supports hard drives larger than 2.2TB in 64-bit, with full storage space utilization, helping deliver far more exciting computing than traditional BIOS versions!
Energy Efficiency All Around
Tap into the world's first real-time PC power saving chip through a simple onboard switch or AI Suite II utility. Get total system-wide energy optimization by automatically detecting current PC loadings and intelligently moderating power consumption. This also reduces fan noise and extends component longevity!
Any Memory is A-OK!
MemOK! quickly ensures memory boot compatibility. This remarkable memory rescue tool requires a mere push of a button to patch memory issues. MemOK! determines failsafe settings and dramatically improves system boot success. Get your system up and running in no time!
Accessible Performance on Demand
This intutive performance-improvement tool allows users to adjust the system performance paramaters with just a few clicks through its user-friendly interface. ASUS TurboV also allows users to save several profile settings to suit system performance scenarios as well.
8+2 Phase Power Design
To fully unleash the latest Intel® Sandy Bridge CPU´s potential, this motherboard has adopted a brand new 8-phase VRM power design. It delivers high power efficiency and supreme overclocking ability. Furthermore, high quality power components can effectively lower system temperature to ensure longer component lifespan. This motherboard also features an extra 2-phase power dedicated to integrated memory controller.
Power eSATA on the Go
The Power eSATA solution combines the eSATA connector and power source together, allowing you to use external SATA devices without the need of additional power source*. Easily backup photos, videos and other entertainment contents on external devices.
* Power eSATA requires a specially designed signal cable to provide 5V power for the external SATA device. The cable is purchased separately.
GreenASUS
The motherboard is European Union´s Energy-related Products (ErP) ready, and ErP requires products to meet certain energy efficiency requirements in regards to energy consumptions. This is in line with ASUS vision of creating environment-friendly and energy-efficient products through product design and innovation to reduce carbon footprint of the product and thus mitigate environmental impacts.
