Akasa VGA RAM heatsink heat sink compound VGA RAM heatsink
Passive cooling kit for VGA memoryModern graphics cards push their onboard memory to the maximum generating a lot of harmful heat.\n
Akasa VGA RAM heatsink heat sink compound VGA RAM heatsink
Passive cooling kit for VGA memoryModern graphics cards push their onboard memory to the maximum generating a lot of harmful heat.\n
Akasa Performance Compund 455 45 - 240°C, 5g
AK-455-5G is a new improved formulated thermal compound that gives hi-performance heat transfer between the CPU and heatsink. Minimise
Akasa Thermal Compound AK-455 2.4W/m·K heat sink compound Thermal Compound AK-455
AK-455 is a new improved formulated thermal compound that gives hi-performance heat transfer between the CPU and heatsink. M
Akasa AK-TT12-80 0.9W/m·K heat sink compound Excellent thermal conductivity, 80x80mm, double sided, micro-fibreglass reinforced
Akasa double-sided thermal adhesive tape is a highly effective the
Akasa AK-TC 5022 Thermal Compound 4W/m·K 3.5g heat sink compound AK-TC 5022 Thermal Compound
Pro-Grade+ Silicone-tech Evolutionary 5022 Thermal Compound\nGet more from your cooler. Pro-grade+ Silicone-tech evolutio
Akasa AK-460 Thermal Compound 3.3W/m·K 3.5g heat sink compound AK-460 Thermal Compound
Pro-Grade Silicone Technology Evolution leads to Outstanding Thermal Performance\n\nPro-grade Silicone technology evolution t
Akasa AK-TC Termal interface cleaner heat sink compound AK-TC Termal interface cleaner
Tim Clean fluid removes all thermal pads and silver based thermal grease from the base of heatsinks and CPU surface. T
Akasa Thermal compound 9.24W/m·K 5g heat sink compound Thermal compound
AK-450 is a silver based thermal compound with high thermal conductivity, low bleed and temperature stability. AK-450 is formulated
Akasa TIM Kit TIM Kit, AK-455, 76 CPS, 2.4 W/mK, 5g + AK-TC, 125ml
<b>Complete solution for cooler installation</b>\nTIM Clean fluid removes all therma
Akasa AK-TT300-01 heat sink compound Thermal gap filler, 1.2 W/mK, 600 ppm/C, 1.5 mm
Akasa thermal gap filler is a thermally conductive interface pad which is versatile and suitable for
Akasa AK-TT300-02 heat sink compound Thermal gap filler, 1.2 W/mK, 600 ppm/C, 5 mm
Akasa thermal gap filler is a thermally conductive interface pad which is versatile and suitable for us
Akasa AK TC-5022 heat sink compound -45 - 200 °C, 4 W/m·K, 0.061 °C/W, 3.5 g, grey
<b>Evolutionary Silicone Technology Compound</b>\n- Low thermal resistance for superior he
