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Inter-Tech G751 0.5g heat sink compoundShin-Etsu MicroSi Thermal compound, 0.5g
Inter-Tech MX-830SPCPU Thermal compound MX-830SP, 0.8 g <b>"Dynatron" MX-830SP CPU thermal compound, 0.5g</b>\nBleed at 150 °C/24h < 0.1 %\nEva
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