Akasa AK-TT300-01 heat sink compound

Thermal gap filler, 1.2 W/mK, 600 ppm/C, 1.5 mm Akasa thermal gap filler is a thermally conductive interface pad which is versatile and suitable for use between components and their heat sinks. The pad moulds around uneven surfaces and can be cut to size to effectively solve and manage unwanted thermal issues.

- Suitable for uneven surfaces.
- Cut to size and stackable.
- Two sizes: 1.5mm and 5mm thickness available.