Other features
| Interface type |
SSTL_18 |
| Number of pins |
200 |
Memory
| Memory clock speed |
667 MHz |
| Memory voltage |
1.8 V |
| CAS latency |
5 |
| Internal memory |
1 GB |
| Internal memory type |
DDR2 |
Additionally
| Chips organization |
x8, x16 FBGA DRAM |
1 GB Memory Module SO-DIMM
DDR2 is the next-generation evolution of DDR memory technology. DDR2 memory features faster speeds, higher data bandwidths, lower power consumption and enhanced thermal performance. DDR2 memory chips will be available in Fine-pitch BGA (FBGA) chip packages for improved electrical and thermal characteristics. In addition, DDR2 memory chips will incorporate On-Die Termination (ODT) to minimize memory signal reflections at high speeds, thereby improving timing margins. DDR2 memory chips will come in capacities up to 4 Gigabits, allowing for higher-capacity modules.
The Module is DDR2-667 CL5 Small Outline Memory module. The Module density from 256MB to 2GB, it consists DDR2 667MHz Synchronous DRAMs in FBGA packages, Memory Module intented for mounting into 200-pin edge connector sockets.