Memory
| Memory clock speed |
533 MHz |
| CAS latency |
4 |
| Internal memory |
1 GB |
| Internal memory type |
DDR2 |
| Memory voltage |
1.8 V |
Other features
| Interface type |
SSTL_18 |
| Number of pins |
240 |
Additionally
| Chips organization |
x8 FBGA DRAM |
DDR2 1024MB Memory Module
DDR2 is the next-generation evolution of DDR memory technology. DDR2 memory features faster speeds, higher data bandwidths, lower power consumption and enhanced thermal performance. DDR2 memory chips will be available in Fine-pitch BGA (FBGA) chip packages for improved electrical and thermal characteristics. In addition, DDR2 memory chips will incorporate On-Die Termination (ODT) to minimize memory signal reflections at high speeds, thereby improving timing margins. DDR2 memory chips will come in capacities up to 4 Gigabits, allowing for higher-capacity modules.
The Module is 128M x 64-bit (1GB) DDR2 533 CL4 SDRAM , Dual ranks Unbuffered Memory module . The Module consists of sixteen 64MX8 bit DDR2 533 Synchronous DRAMs in stack FBGA packages, Memory Module intented for mounting into 240-pin edge connector sockets.