–150°C - 125°C, 2.5-gram syringe
The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. The Evolution of Cool!
<b>Features:
High-Density ceramic content:</b>
Céramique uses a high-density layered composite of five unique shapes of thermally conductive aluminum oxide, boron nitride and zinc oxide sub-micron particles to maximize particle-to-particle contact area and thermal transfer in micro to moderate bond line situations. This exclusive combination provides performance exceeding most metal based compounds.
<b>Controlled Triple-Phase Viscosity:</b>
Céramique does not contain any silicone. The suspension fluid is a proprietary mixture of advanced polysynthetic oils that provide superior performance and long-term stability. During the system's initial use, the heat from the CPU lowers the viscosity of the compound to enhance the filling of the microscopic valleys and ensure a minimum bond line between the heatsink and the CPU core. Then the compound thickens slightly over the next 100 to 300 hours of use to its final consistency designed for long-term stability. (This should not be confused with conventional phase change pads that are pre-attached to many heatsinks. Those pads melt each time they get hot then re-solidify when they cool. The viscosity changes that Céramique goes through are much more subtle and ultimately much more effective.)
<b>Excellent Stability:</b>
Céramique is engineered to not separate, run, migrate, or bleed.
<b>Electrical Insulator:</b>
Céramique does not contain any metal or other electrically conductive materials. It is a pure electrical insulator, neither electrically conductive nor capacitive.
