Performance
| Motherboard form factor |
Mini ITX |
| Audio system |
VIA HDA |
| Component for |
PC |
Memory
| Supported memory clock speeds |
1066, 1333 MHz |
| Non-ECC |
Y |
| Memory channels |
Dual |
| Number of memory slots |
2 |
| Maximum internal memory |
16 GB |
BIOS
| BIOS memory size |
32 MB |
| BIOS type |
AMI |
| ACPI version |
2.0a |
Other features
| Controller (2nd) interface type |
SATA 3.0 Gb/s |
| Controller interface type |
SATA 6.0 Gb/s |
Internal I/O
| USB 2.0 connectors |
2 |
| S/PDIF out connector |
Y |
| ATX Power connector (24-pin) |
N |
| Number of SATA III connectors |
2 |
| Number of SATA II connectors |
4 |
| CPU fan connector |
Y |
| Chassis intrusion connector |
Y |
| Number of chassis fan connectors |
1 |
| Number of EATX power connectors |
1 |
| Front panel audio connector |
Y |
Graphics
| Maximum graphics adapter memory |
1748 MB |
| On-board graphics adapter |
Y |
Back panel I/O ports
| DVI-D ports quantity |
1 |
| PS/2 ports quantity |
1 |
| Headphone outputs |
1 |
| S/PDIF out port |
Y |
| Microphone in |
Y |
| USB 3.0 (3.1 Gen 1) Type-A ports quantity |
2 |
| HDMI ports quantity |
1 |
| VGA (D-Sub) ports quantity |
1 |
Expansion slots
| PCI Express x16 slots |
1 |
| PCI Express slots version |
2.0 |
Additionally
| Chipset |
Intel H67 |
| Ethernet LAN (RJ-45) ports quantity |
1 |
P8H67-I - Intel® Socket 1155, Intel® H67(B3) Express, 2 x DIMM, Max. 16 GB, DDR3 1333/1066 Non-ECC, 1 x PCIe 2.0 x16, 2 xSATA 6.0 Gb/s, 4 x SATA 3.0 Gb/s, Gigabit LAN, VIA 8-Ch., Mini ITX
CPU, Chipset and Graphics features
LGA1155 socket for Intel® Second Generation Core™ i7/ Core™ i5/ Core™ i3 Processors
This motherboard supports the latest Intel® second generation Core™ i7/Core™ i5/Core™ i3 processors in the LGA1155 package, with memory and PCI Express controllers integrated to support 2-channel (4 DIMM) DDR3 memory and 16 PCI Express 2.0 lanes. This provides great graphics performance. Intel® second generation Core™ i7/Core™ i5/Core™ i3 processors are among the most powerful and energy efficient CPUs in the world.
Intel® H67 Chipset
The Intel® H67 Express Chipset is the latest single-chipset design to support new socket 1155 Intel® second generation Core™ i7/Core™ i5/Core™ i3 processors. It provides improved performance by utilizing serial point-to-point links, allowing increased bandwidth and stability. Additionally, the H67 provides 2 SATA 6Gb/s and 4 SATA 3Gb/s ports for faster data retrieval at double the bandwidth of current bus systems. Moreover, Intel® H67 Express Chipset also supports iGPU function.
Latest Transfer Technology
USB 3.0 Support
Experience ultra-fast data transfers at 4.8Gbps with USB 3.0--the latest connectivity standard. Built to connect easily with next-generation components and peripherals, USB 3.0 transfers data 10X faster and is also backward compatible with USB 2.0 components.
Native SATA 6Gb/s Support
The Intel® H67 Chipset natively supports next-generation Serial ATA (SATA) storage interface, this motherboard delivers up to 6.0 Gb/s data transfer rates. Additionally, get enhanced scalability, faster data retrieval, double the bandwidth of current bus systems.
ASUS Exclusive Features
AI Suite II
One-stop Access to Innovative ASUS Features
With its user-friendly interface, ASUS AI Suite II consolidates all exclusive ASUS features into one simple-to-use package. It allows users to supervise overclocking, energy management, fan speed, voltage and sensor readings, even interact with mobile devices via Bluetooth. This all-in-one software offers diverse and easy to use functions, with no need to switch back and forth between different utilities.
GPU Boost
Go to the Limit with iGPU Level Up!
GPU Boost accelerates the integrated GPU for extreme graphics performance. The user-friendly interface facilitates flexible frequency adjustments. It easily delivers stable system-level upgrades for every use.
ASUS EZ DIY
EFI BIOS (EZ Mode)
Flexible, Easy BIOS Interface
ASUS brand new EFI BIOS offers a user-friendly interface that goes beyond traditional keyboard only BIOS, to enable more flexible and convenient mouse controls. Users can easily navigate the new EFI BIOS with the same smoothness as their operating system. The exclusive EZ Mode displays frequently-accessed setup info, while the Advanced Mode is for experienced performance enthusiasts that demand far more intricate system settings.
ASUS Quiet Thermal Solution
ASUS FanXpert
Active Quiet & Cool
ASUS Fan Xpert intelligently allows users to adjust both the CPU and chassis fan speed according to different ambient temperature , which is caused by different climate conditions in different geographic regions and system loading.Built-in variety of useful profiles offer flexible controls of fan speed to achieve a quiet and cool environment.
ASUS Power Design
ASUS EPU
System Level Energy Efficiency
The ASUS EPU (Energy Processing Unit) provides total system power management by detecting current PC loadings and intelligently moderating power usage for critical PC components in real-time–helping save power and money!
ASUS Anti-Surge Protection
This special design prevents expensive devices and the motherboard from damage caused by power surges from switching power supply(PSU).
Industry Standard
S/PDIF-out on Back I/O Port
This motherboard provides convenient connectivity to external home theater audio systems via optical S/PDIF-out (SONY-PHILIPS Digital Interface) jacks. It allows to transfer digital audio without converting to analog format and keeps the best signal quality.
8 Channel Audio Codec
Enjoy high-end sound system on your PC!
The onboard 8-channel HD audio (High Definition Audio, previously codenamed Azalia) CODEC enables high-quality 192KHz/24-bit audio output, jack-sensing feature, retasking functions and multi-streaming technology.
RoHS
GreenASUS
The motherboard is European Union´s Energy-related Products (ErP) ready, and ErP requires products to meet certain energy efficiency requirements in regards to energy consumptions. This is in line with ASUS vision of creating environment-friendly and energy-efficient products through product design and innovation to reduce carbon footprint of the product and thus mitigate environmental impacts.
