Ports & interfaces
| Serial ports quantity |
1 |
| VGA (D-Sub) ports quantity |
1 |
Storage
| Controller interface type |
SATA |
| Number of hard drives supported |
4 |
Graphics
| Maximum graphics adapter memory |
8 MB |
Memory
| Maximum internal memory |
96 GB |
Additionally
| Chipset |
Intel 5520 |
| Ethernet LAN (RJ-45) ports quantity |
3 |
RS702D-E6/PS8
Duo Independent Nodes with Extreme Speed Infiniteband onboard
Supporting Intel® Xeon® 5500 series processor, RS702D, the dual 2-Processor systems provide extreme performance for customers with 4-way, 16-core computing capability in 1U. The design of 1~8 hot swap 2.5” SATA/SAS HDDs support is space-saving with its normal form factor.True Duo Nodes in 1U with Two Independent Power Supply
RS702D is designed with dual DP system in 1U chassis for high dense computing, with each as an independent computing node. Different from other solution in the market, the RS702D has two independent power supplies for high availability and individual system maintenance, even if one power supply fails, the system still keeps running.
Infiniband on Board
The highest performance interconnect solution with performance up to 20Gb/s to provide world class low latency and high bandwidth connectivity for Enterprise Data Centers, Cloud Computing, Higher Performance Computing, and embedded environments.
Multiple PIKE Solutions for Different Use
With the ASUS optional PIKE providing slim-sized and flexible storage options, direct SAS RAID upgrades can be achieved directly via a unique slot—without sacrificing expansion capability. The ASUS PIKE further provides customers with multiple I/O solutions and RAID functions. Users can choose PIKE 1064E, PIKE 1068E, PIKE 1078 and PIKE 6480 for their different use.
Extreme System Power Efficiency
With current trends leaning towards power efficiency, the RS702D is equipped with the ASUS exclusive EPU technology, which intelligently calibrates the best possible settings to ensure the best power management. The two 80+ PSU further saves power and reduce heat dissipation.