Memory
ECC |
Y |
Internal memory |
4 GB |
Maximum internal memory |
16 GB |
Memory slots |
4 |
Memory clock speed |
1333 MHz |
Internal memory type |
DDR3-SDRAM |
Expansion slots
PCI Express x4 slots |
1 |
PCI Express x8 slots |
2 |
PCI slots |
1 |
PCI Express slots version |
2.0 |
Processor special features
Intel Trusted Execution Technology |
Y |
Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
Intel® Wireless Display (Intel® WiDi) |
N |
Intel Demand Based Switching |
Y |
Enhanced Intel SpeedStep Technology |
Y |
Intel FDI Technology |
N |
Intel VT-x with Extended Page Tables (EPT) |
Y |
Intel vPro Technology |
N |
Intel Clear Video Technology for MID |
N |
Intel® My WiFi Technology (Intel® MWT) |
N |
Intel Enhanced Halt State |
Y |
Intel Hyper-Threading Technology |
N |
Intel® Anti-Theft Technology (Intel® AT) |
N |
Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
CPU configuration (max) |
1 |
Intel Dual Display Capable Technology |
N |
Intel Clear Video Technology |
N |
Intel 64 |
Y |
Intel® Insider™ |
N |
Intel® Quick Sync Video Technology |
N |
Processor ARK ID |
42927 |
Intel Virtualization Technology (VT-x) |
Y |
Intel Flex Memory Access |
N |
Intel Fast Memory Access |
N |
Intel Rapid Storage Technology |
N |
Intel® Turbo Boost Technology |
Y |
Processor
Thermal Monitoring Technologies |
N |
Bus type |
DMI |
Memory types supported by processor |
DDR3-SDRAM |
Supported instruction sets |
SSE4.2 |
ECC supported by processor |
Y |
Tcase |
72.7 °C |
Maximum internal memory supported by processor |
32 GB |
Processor frequency |
2.4 GHz |
Stepping |
B1 |
Processor operating modes |
64-bit |
Embedded options available |
Y |
FSB Parity |
N |
Number of Processing Die Transistors |
774 M |
PCI Express configurations |
4x4, 2x8, 1x16 |
Conflict Free processor |
N |
Memory channels supported by processor |
Dual |
Memory bandwidth supported by processor (max) |
21 GB/s |
Memory clock speeds supported by processor |
1333, 1066, 800 MHz |
Processor cache type |
Smart Cache |
Processor code |
SLBLJ |
Physical Address Extension (PAE) |
36 bit |
Maximum number of PCI Express lanes |
1 |
Idle States |
Y |
Execute Disable Bit |
Y |
Processor boost frequency |
2.8 GHz |
Processor cache |
8 MB |
Number of processors installed |
1 |
Processor cores |
4 |
Thermal Design Power (TDP) |
95 W |
CPU multiplier (bus/core ratio) |
18 |
Processor lithography |
45 nm |
Processor package size |
37.5 mm |
Ports & interfaces
VGA (D-Sub) ports quantity |
1 |
Power
Power supply |
300 W |
Number of power supply units |
1 |
Networking
Networking features |
Gigabit Ethernet |
Certificates
Compliance industry standards |
IEEE 802.3, IEEE 802.3u, IEEE 802.3ab |
Design
Chassis type |
Tower |
Optical drive type |
DVD-RW |
Storage
Hard drive interface |
Serial ATA |
RAID support |
Y |
Number of hard drives supported |
4 |
Total storage capacity |
1000 GB |
Number of hard drives installed |
2 |
Hard drive capacity |
500 GB |
Hot-swap |
Y |
Other features
Mac compatibility |
N |
Graphics adapter family |
Matrox |
Graphics
Maximum graphics adapter memory |
16 MB |
Additionally
Ethernet LAN (RJ-45) ports quantity |
2 |
Intel AES New Instructions |
N |
Ethernet LAN connection |
Y |
System bus data transfer rate |
2.5 GT/s |
Graphics |
G200eW |
Processing die size |
296 mm² |
Chipset |
Intel 3400 |
InTru™ 3D Technology |
N |
b.com BT-114. Processor frequency: 2.4 GHz, Processor family: Intel® Xeon® 3000 Sequence, Processor model: X3430. Total storage capacity: 1000 GB, Hard drive interface: Serial ATA, Hard drive capacity: 500 GB. Internal memory: 4 GB, Internal memory type: DDR3-SDRAM, Maximum internal memory: 16 GB. Maximum graphics adapter memory: 16 MB. Networking features: Gigabit Ethernet