Performance
| Motherboard form factor |
ATX |
| Motherboard chipset family |
Intel |
| Audio system |
Realtek ALC892 |
| Component for |
PC |
Memory
| Supported memory clock speeds |
1066, 1333, 1600, 1866, 2133 MHz |
| Supported memory types |
DDR3-SDRAM |
| Memory channels |
Dual |
| Memory slots type |
DIMM |
| Number of memory slots |
4 |
| Maximum internal memory |
32 GB |
Internal I/O
| USB 2.0 connectors |
2 |
| S/PDIF out connector |
Y |
| USB 3.0 (3.1 Gen 1) connectors |
1 |
| Number of SATA III connectors |
2 |
| Number of SATA II connectors |
4 |
| CPU fan connector |
Y |
| Front panel audio connector |
Y |
Back panel I/O ports
| DVI-D ports quantity |
1 |
| PS/2 ports quantity |
1 |
| USB 3.0 (3.1 Gen 1) Type-A ports quantity |
2 |
| HDMI ports quantity |
1 |
| VGA (D-Sub) ports quantity |
1 |
Expansion slots
| PCI slots |
2 |
| PCI Express x16 slots |
1 |
| PCI Express x1 slots |
2 |
| PCI Express x4 slots |
1 |
| PCI Express slots version |
2.0, 3.0 |
Processor
| Processor thermal power (max) |
95 W |
Packaging content
| Quick installation guide |
Y |
Additionally
| Chipset |
Intel Z75 |
| Ethernet LAN connection |
Y |
| Ethernet LAN (RJ-45) ports quantity |
1 |
TZ75B - ATX, Intel Z75, LGA 1155, 4 x DDR3 DIMM, max 32GB, PCI-E x16 3.0, RAID 0,1,5,10, USB 3.0, HDMI
- Support the Intel 3rd and 2nd generation Core i7 and Core i5 processors in the 1155 package
- Intel Z75 single chip architecture
- Support 4-DIMM DDR3-2133(OC)/1866(OC)/1600/1333 up to 32G maximum capacity
- Support SATA 6Gb/s 2X speed than current SATA 3G
- Support USB 3.0
- 100% X.D.C solid capacitor
- BIOSTAR G.P.U (Green Power Utility) Technology for Energy Saving
- BIOSTAR Toverclocker utility
USB 3.0
Experience Fastest data transfers at 5 Gbps with USB 3.0--the new latest connectivity standard. Built to connect easily with next-generation components and peripherals, USB 3.0 transfers data 10X faster and backward compatible with previous USB 2.0 components.
6 Phase Power Phase Design
6-phase VRM design with high quality power components such as low RDS(on) Mosfet for lower temperature has the advantage to raise the overclocking ability
100% Solid Caps
With armor-plated Biostar Technology, all capacitors are placed with 100% solid capacitors that have a lasting life cycle, durability and stability for crucial components
BIO-Remote 2
BIO-Remote2 Technology is featuring users a better Home Theater environment. Users who own either Android mobile or Apple goods are able to access and control your PC remotely; At this moment, you’re smart device became a intelligent and functional remote controller; more than that, BIO-Remote2 also includes both function of mouse pad and power point presentation mode
Charger Booster
Charger booster is the best and efficient charger solution for apple devices such as iPad, iPhone. Basically, Charger booster Technology is able to boost the charging time to be more efficiency and faster once any apple goods connecting to our Motherboard. With charger booster technology, you are able to charge your apple devices up to 42 % faster
Blu-ray Audio
Upgrading your Audio performance in the easiest way is choosing BIOSTAR ultimate Motherboard. It does support Blu-ray audio DRM (compatible driver/software) and provide the higher audio output of 24 bit/ 192KHz than the 16 bit/ 48KHz from the normal MB. You will experience the high quality sound effect with pure Blu-Ray Audio.
Intel Z75 chipset
Intel Z75 is the first chip to use Intel's 22nm tri-gate transistors, which will help scale frequency and reduce power consumption. It features an integrated GPU and it is backwards compatible with previous LGA-1155(Sandy Bridge) motherboards. The Intel Z75 chipset also supports USB 3.0 natively
Intel LGA 1155 3rd Generation Intel Core™ Processor support
Intel 3rd generation processor "Ivy Bridge" is the codename for Intel's 22nm of the Sandy Bridge microarchitecture. The first to use tri-gate("3D") transistors, it is also backwards-compatible with the Sandy Bridge platform requiring a BIOS/firmware update
Intel LGA 1155 2nd Generation Intel Core™ Processors support
2nd Generation Intel® Core™ Processors with New 32nm Intel® micro architecture / Impressive leap in energy-efficient performance / Optimized Intel Turbo Boost Technology and Intel Hyper-Threading Technology / Significant advances in visual and 3D graphics capabilities / New Intel RAVX instructions for enhanced floating point intensive application performance
Dual Channel DDR3
It supports 2 or 4 DIMM Slots DDR3 memory that features data transfer rates of DDR3 2000(O.C.)/1800(O.C.)/1600/1333. The processor support 2 memory channels and setting the memory multiplier, allows selection of the channel speed. These clearly uplift the band width and boost the overall system performance
ATI CrossFire X™ Technology
ATI CrossFireX™ is the ultimate multi-GPU performance gaming platform. With game-dominating power, ATI CrossFireX technology enables two or more discrete graphics processors to work together to improve system performance. It supports up to four ATI Radeon™ HD graphics cards, making it the most scalable gaming platform ever!
DVI
DVI is better than VGA for LCD displays since it is digital while VGA is analog. For LCD displays, the picture is digitized pixel per pixel. Through DVI, the panel gets data for each pixel, so the picture generated in the Graphics device matches the pixels on the panel itself
SATA 6Gb/s
High Efficiency of Data transfer rate
SATAIII 6Gbps provides a higher bandwidth to retrieve and transfer HD media. With this super speed data transfer, SATAIII allows an incredible data boost which is 2x faster than the SATA 3G
HDMI 3D Visual
The HDMI 3D Visual provides a level of interoperability for devices designed to deliver 3D content over the HDMI connection. The latest HDMI Specification adds key enhancements to support the market requirements for bringing broadcast 3D content into the home featuring key enhancements for 3D applications including the addition of mandatory 3D formats for broadcast content
