Performance
| Supported processor sockets |
Socket AM3, Socket AM3+, Socket AM2+, Socket FM2, Socket AM2, LGA 2011-v3 (Socket R), LGA 1151 (Socket H4), Socket FM2+, Socket FM1, Socket AM1 |
| Maximum airflow |
65 cfm |
| Minimum airflow |
16.5 cfm |
| Minimum air pressure |
0.48 mmH2O |
| Maximum air pressure |
3.33 mmH2O |
| Noise level (low speed) |
6.5 dB |
| Noise level (high speed) |
22 dB |
| Rotational speed (min) |
800 RPM |
| Rotational speed (max) |
2000 RPM |
| Type |
Cooler |
| Suitable for |
Processor |
| Number of fans |
1 fan(s) |
| Fan diameter |
120 mm |
| Pulse-width modulation (PWM) support |
Y |
Weight & dimensions
| Heatsink dimensions (W x D x H) |
135 x 77 x 124 mm |
| Fan dimensions (W x D x H) |
120 x 25 x 120 mm |
| Heatsink weight |
392 g |
Power
| Voltage |
12 V |
| Rated current |
0.08 A |
Intel/AMD, 144 x 141 x 105 mm, 154 g, 800 - 2000 rpm, 16.5 - 65 cfm, 6.5 - 22 dB, 0.48 - 3.33 mmH2O, 160000 h, 12 V, 0.08 A, 0.96 W, 4-pin, PWM
Cooler Master GeminII S524 Ver 2 provides excellent performance featuring a 120mm Silencio fan for higher air pressure, and unique top-down Accelerated Cooling design to dissipate heat for the CPU, memory, and the motherboard.
ACCELERATED COOLING
This isn't your typical cooler. The GeminII S524 is designed to not only keep your processor exceptionally cool, but it offers a bonus in providing more airflow across your RAM and your motherboard. GeminII S524 version 2 utilizes the latest in Cooler Master technologies, including a high-pressure Silencio fan, X-Vent Air Guide designs, and Direct Contact Heatpipes to provide the best in thermal performance.
ALL-NEW SILENCIO FAN
A high-pressure, low-noise fan blade design brings superior performance without making a ruckus in your system.
COMPATIBILITY
GeminII S524 Version 2 sports an optimized profile for smaller cases and common RAM sizes.
X-VENT TECHNOLOGY
Specially engineered air channels guide the cool air around the Direct Contact Heatpipes, meaning improved heat dissipation.
DIRECT THERMAL TRANSFER
Our innovative CDC™ (Continuous Direct Contact) technology placing Five (5) Direct Contact Heatpipes to accelerate the surface to surface thermal transfer.
ACCELERATED AIRFLOW
Excellent cooling of CPU, memory and motherboard components
COVERAGE
Parts, product replacement, and free technical support.
