Weight & dimensions
| Fan dimensions (W x D x H) |
120 x 120 x 25 mm |
| Heatsink weight |
492 g |
| Fan weight |
106 g |
| Heatsink dimensions (W x D x H) |
116 x 51 x 158 mm |
Power
| Rated current |
0.1 A |
| Voltage |
12 V |
Performance
| Supported processor sockets |
Socket AM3, Socket AM3+, Socket AM2+, Socket FM2, LGA 2011-v3 (Socket R), LGA 1151 (Socket H4), Socket FM2+, Socket FM1 |
| Maximum airflow |
54.65 cfm |
| Minimum airflow |
24.9 cfm |
| Minimum air pressure |
0.3 mmH2O |
| Maximum air pressure |
2.03 mmH2O |
| Noise level (low speed) |
9 dB |
| Noise level (high speed) |
36 dB |
| Rotational speed (min) |
600 RPM |
| Suitable for |
Processor |
| Number of fans |
1 fan(s) |
| Fan diameter |
120 mm |
| Number of heat pipes |
4 |
| Heat pipes diameter |
6 mm |
| Fan thickness |
25 mm |
| Rotational speed (max) |
1700 RPM |
| Type |
Cooler |
Technical details
| Bearing technology |
POM |
| Fan connector |
4-pin |
600 - 1700 RPM, 24.9-54.65 CFM, 9-27.2 dBA, 4-Pin, 12 VDC, 0.1 A
Hyper 212X
The latest in the extremely popular Hyper 212 series, Cooler Master’s Hyper 212X is based on the same patented CDC Quad heatpipe array as the 212 EVO but features several improvements that boost performance and further reduce noise. Thanks to our brand new Smart Engine and POM bearing, the 212X is incredibly durable and will virtually last a lifetime
X-Vents Design
Positioned in a 45 degree angle and surrounding the heatpipe, each fin-blade features X-shaped vents that create areas of high and low air pressure, resulting in several controlled vortices. These small and chaotic turbulences produce strong gusts that reduce overall airflow but improve airflow where it matters the most – next to the heatpipes.
Patent “V” Shaped Array
Funnel shaped aluminum fins and a series of perforated dimples guide the airflow towards the heatpipes. The combination of both of these patent technologies results in notably higher airflow over the heatpipes and the adjacent fin area, which ultimately reduces CPU temperatures.
The specially designed X-Vents act similar to tiny airplane wings and prevent deadspots behind and between heatpipes. The combination of these patented technologies results in a notably higher airflow over the heatpipes and the adjacent fin area, ultimately reducing CPU
temperatures.
Patented CDC™ Technology
4 Continuous Direct Contact Heatpipes create a gap-less contact surface for unmatched cooling efficiency.
Optimized fin design
Aluminum Fin Array with Tunnel Effect layout creates micro vortices that boost the airflow and circulate it around the heatpipes.
Supports all current CPU Sockets
Fast and easy to install and extremely reliable, our famous X-Bracket mounting system is compatible with all current sockets.
