Cooler Master ThermalFusion 400 2.89W/m·K 4g heat sink compound

Cooler Master ThermalFusion 400 2.89W/m·K 4g heat sink compound

MPN: RG-TF4-TGU1-GP
🚚 Select the country of delivery:
Delivery from:
Germany
Updating price ... 📣 Send Price inquiry Не поставляется
Delivery cost & estimated delivery time:
От
days

Where to buy and prices (Advertising *)

On Top
в наличии
* Alle Preise inkl. der jeweils geltenden gesetzlichen Mehrwertsteuer, ggfs. zzgl. Versandkosten. Alle Angaben ohne Gewähr. Preisänderungen sind in der Zwischenzeit möglich.

Technical specifications

On Top

Technical details

Thermal conductivity 2.89 W/m·K
ThermalFusion 400 is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and non-electrical conductive traits can avoid any short circuit incidence. ThermalFusion 400 is the ultimate solution for thermal dissipation to improve CPU, GPU cooling and other bonding applications.

Features
-High Thermal Conductivity.
-Low Thermal Resistance.
-Non-Curing.
-Non-Corrosive.
-Easy Application with Included Razor Blade.
Фотографии

    Password recovery
    To recover your password, please enter in the box below your email address with which you have registered:
    The password reset code has been sent to your Email.
    Код уже был отправлен Вам ранее.
    Вы можете ввести его в поле выше, или получить новый код через сек.
    An error has occurred. Please check your e-mail address and try again.
    Ваш новый пароль:

    Name is empty


    Выберите страну доставки

    You have not written a message

    By clicking on the "Send" button, you agree that your data will be used to process your request. Further information and revocation instructions can be found in the data protection declaration.

    Your message has been sent!

    Close

    1
    Catalog
    Cancel Close
    Бренды:
      Выберите бренды
        Show more close
          Area search
          Worldwide
          Категории
            Product