Processor special features
| Intel Demand Based Switching |
Y |
| Enhanced Intel SpeedStep Technology |
Y |
| Intel FDI Technology |
N |
| Intel VT-x with Extended Page Tables (EPT) |
Y |
| Intel vPro Technology |
N |
| Intel Clear Video Technology for MID |
N |
| Intel® My WiFi Technology (Intel® MWT) |
N |
| Intel Enhanced Halt State |
Y |
| Intel Hyper-Threading Technology |
Y |
| Intel® Anti-Theft Technology (Intel® AT) |
N |
| Intel® Smart Cache |
Y |
| Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
| CPU configuration (max) |
2 |
| Intel Dual Display Capable Technology |
N |
| Intel Clear Video Technology |
N |
| Intel 64 |
Y |
| Intel® Insider™ |
N |
| Intel® Quick Sync Video Technology |
N |
| Processor ARK ID |
40201 |
| Intel Virtualization Technology (VT-x) |
Y |
| Intel Trusted Execution Technology |
N |
| Intel Flex Memory Access |
N |
| Intel Fast Memory Access |
N |
| Intel Rapid Storage Technology |
N |
| Intel® Turbo Boost Technology |
Y |
| Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
| Intel® Wireless Display (Intel® WiDi) |
N |
Processor
| ECC supported by processor |
Y |
| Tcase |
70 °C |
| Maximum internal memory supported by processor |
144 GB |
| Processor frequency |
2.26 GHz |
| Stepping |
D0 |
| Processor system type |
DP |
| Processor operating modes |
64-bit |
| Embedded options available |
N |
| FSB Parity |
N |
| Number of Processing Die Transistors |
731 M |
| Conflict Free processor |
N |
| Physical Address Extension (PAE) |
Y |
| Memory channels supported by processor |
Triple |
| Memory bandwidth supported by processor (max) |
25.6 GB/s |
| Memory clock speeds supported by processor |
1066, 800 MHz |
| Processor cache type |
Smart Cache |
| Processor code |
SLBFA |
| Physical Address Extension (PAE) |
40 bit |
| Thermal Monitoring Technologies |
N |
| Idle States |
Y |
| Execute Disable Bit |
Y |
| Number of QPI links |
2 |
| Processor boost frequency |
2.48 GHz |
| Processor cache |
8 MB |
| Number of processors installed |
1 |
| Processor cores |
4 |
| Thermal Design Power (TDP) |
60 W |
| CPU multiplier (bus/core ratio) |
17 |
| Processor lithography |
45 nm |
| Processor package size |
42.5 mm |
| Bus type |
QPI |
| Memory types supported by processor |
DDR3-SDRAM |
Storage
| RAID support |
N |
| Maximum storage capacity |
8 TB |
| Number of hard drives supported |
4 |
| Total storage capacity |
292 GB |
| Number of hard drives installed |
2 |
| Hard drive capacity |
146 GB |
| Hot-swap |
Y |
| Hard drive size |
3.5 " |
Memory
| Maximum internal memory |
128 GB |
| Memory slots |
8 DIMM |
| Memory clock speed |
1066 MHz |
| ECC |
Y |
| Internal memory |
8 GB |
Power
| Number of power supply units |
1 |
| Power supply |
480 W |
Graphics
| Maximum graphics adapter memory |
8 MB |
Networking
| Network ready |
Y |
| Networking features |
Gigabit Ethernet |
Design
| Chassis type |
Rack (1U) |
| Optical drive type |
DVD-ROM |
Ports & interfaces
| Serial ports quantity |
1 |
| VGA (D-Sub) ports quantity |
2 |
Additionally
| Ethernet LAN connection |
Y |
| System bus data transfer rate |
5.86 GT/s |
| Graphics |
G200eW |
| Processing die size |
263 mm² |
| Chipset |
Intel 5500 |
| InTru™ 3D Technology |
N |
| Ethernet LAN (RJ-45) ports quantity |
2 |
| Intel AES New Instructions |
N |
DELL PowerEdge R410. Processor frequency: 2.26 GHz, Processor family: Intel® Xeon® 5000 Sequence, Processor model: L5520. Total storage capacity: 292 GB, Hard drive size: 3.5", Maximum storage capacity: 8 TB. Internal memory: 8 GB, Maximum internal memory: 128 GB, Memory slots: 8 DIMM. Maximum graphics adapter memory: 8 MB. Networking features: Gigabit Ethernet
