Processor special features
| Intel Enhanced Halt State |
Y |
| Intel Hyper-Threading Technology |
Y |
| Intel® Anti-Theft Technology (Intel® AT) |
N |
| Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
| Intel® Turbo Boost Technology |
Y |
| CPU configuration (max) |
1 |
| Intel Dual Display Capable Technology |
N |
| Intel Clear Video Technology |
N |
| Intel 64 |
Y |
| Intel® Insider™ |
N |
| Intel® Quick Sync Video Technology |
N |
| Processor ARK ID |
43233 |
| Intel Virtualization Technology (VT-x) |
Y |
| Intel Trusted Execution Technology |
Y |
| Intel Flex Memory Access |
N |
| Intel Fast Memory Access |
N |
| Intel Rapid Storage Technology |
N |
| Enhanced Intel SpeedStep Technology |
Y |
| Intel FDI Technology |
N |
| Intel VT-x with Extended Page Tables (EPT) |
Y |
| Intel vPro Technology |
N |
| Intel Clear Video Technology for MID |
N |
| Intel® My WiFi Technology (Intel® MWT) |
N |
| Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
| Intel® Wireless Display (Intel® WiDi) |
N |
| Intel Demand Based Switching |
Y |
Processor
| Processor operating modes |
64-bit |
| Embedded options available |
N |
| FSB Parity |
N |
| Number of Processing Die Transistors |
774 M |
| CPU multiplier (bus/core ratio) |
14 |
| PCI Express configurations |
4x4, 2x8, 1x16 |
| Conflict Free processor |
N |
| Memory channels supported by processor |
Dual |
| Memory bandwidth supported by processor (max) |
21 GB/s |
| Memory clock speeds supported by processor |
1333, 1066, 800 MHz |
| Processor cache type |
Smart Cache |
| Physical Address Extension (PAE) |
36 bit |
| Maximum number of PCI Express lanes |
1 |
| Thermal Monitoring Technologies |
N |
| Idle States |
Y |
| Execute Disable Bit |
Y |
| Processor boost frequency |
3.2 GHz |
| Processor cache |
8 MB |
| Number of processors installed |
1 |
| Processor lithography |
45 nm |
| Processor cores |
4 |
| Thermal Design Power (TDP) |
45 W |
| Processor package size |
37.5 mm |
| Maximum internal memory supported by processor |
32 GB |
| Processor frequency |
1.86 GHz |
| Stepping |
B1 |
| Bus type |
DMI |
| Memory types supported by processor |
DDR3-SDRAM |
| Supported instruction sets |
SSE4.2 |
| ECC supported by processor |
Y |
| Tcase |
58.3 °C |
Other features
| Drive bays |
10 |
| Number of drive bays |
2x 2.5" 8x 3.5" |
| Acoustic pressure emissions |
60 dB |
| Video modes resolution |
1600 pixels |
| Manageability features |
IPMI 2.0 |
| Hard disk controller |
SATA 3 Gb/s |
Memory
| Memory clock speed |
1333 MHz |
| Internal memory |
4 GB |
| Maximum internal memory |
32 GB |
| Memory slots |
6 |
Expansion slots
| PCI Express x4 slots |
1 |
| PCI Express x8 slots |
2 |
| PCI slots |
1 |
| PCI Express slots version |
2.0 |
Graphics
| Maximum graphics adapter memory |
64 MB |
Ports & interfaces
| Serial ports quantity |
1 |
| VGA (D-Sub) ports quantity |
1 |
Design
| Optical drive type |
DVD-RW |
| Chassis type |
Tower |
Storage
| Hard drive interface |
Serial ATA |
| Total storage capacity |
20480 GB |
| Hot-swap |
N |
Operational conditions
| Operating altitude |
0 - 3000 m |
| Non-operating altitude |
0 - 9000 m |
Networking
| Networking features |
10/100/1000 Mbps |
Additionally
| Processing die size |
296 mm² |
| Chipset |
Intel 3400 |
| InTru™ 3D Technology |
N |
| System bus data transfer rate |
2.5 GT/s |
| Intel AES New Instructions |
N |
| Ethernet LAN (RJ-45) ports quantity |
2 |
EDMT28L3426, Tower server, w/ Intel XEON L3426, 2GB
The EDMT28 is new generation server, specially designed for SME environments where space and noise-level have to be limited. With its very low energy consumpltion it makes it an ideal solution for environment up to 25 users where no 19 inch rack is available or the server has to placed on the work-floor. The power consumption is approx 50 Watt depending on the configuration.
