Gelid Solutions GP-Extreme 12W/m·K heat sink compound

GP-Extreme, 2.8 g/cm3, 12 W/mK, 0.5 mm The GP-Extreme is designed to provide perfect thermal contact to the heatsink when installed on PCBs with height differences and uneven surfaces such as micro-controller units, memory ICs, analog ICs and other SMD components. Thanks to its softness and ultimate thermal conductivity the GP-Extreme fills spaces properly and offers the best performance in class. The GP-Extreme is nonelectrical conductive, non-corrosive, non-curing and non-toxic. The GP-Extreme ensures an easy application and the thermal pad dimensions of 80×40 mm optimally fit to large PCB surfaces of VGA cards, high-speed HDDs and other densely packed devices.