Number of Processing Die Transistors | 456 M |
---|---|
Processor front side bus | 1333 MHz |
Conflict Free processor | N |
Processor cache type | L2 |
Processor codename | Yorkfield |
Processor code | SLB6C |
Thermal Monitoring Technologies | Y |
Idle States | Y |
Execute Disable Bit | Y |
Thermal Design Power (TDP) | 95 W |
Processor lithography | 45 nm |
Processor package size | 37.5 mm |
Processor cache | 6 MB |
Number of processors installed | 1 |
Processor cores | 2 |
CPU multiplier (bus/core ratio) | 8 |
ECC supported by processor | N |
Tcase | 71.4 °C |
Processor frequency | 2.66 GHz |
Stepping | R0 |
Processor system type | UP |
Processor operating modes | 64-bit |
Embedded options available | N |
FSB Parity | N |
Bus type | FSB |
Intel Dual Display Capable Technology | N |
---|---|
Intel Clear Video Technology | N |
Intel 64 | Y |
Intel® Insider™ | N |
Intel® Quick Sync Video Technology | N |
Processor ARK ID | 35432 |
Intel Virtualization Technology (VT-x) | Y |
Intel Trusted Execution Technology | N |
Intel Flex Memory Access | N |
Intel Fast Memory Access | N |
Intel Rapid Storage Technology | N |
Intel® Turbo Boost Technology | N |
Intel Demand Based Switching | N |
Enhanced Intel SpeedStep Technology | Y |
Intel FDI Technology | N |
Intel VT-x with Extended Page Tables (EPT) | Y |
Intel vPro Technology | N |
Intel Clear Video Technology for MID | N |
Intel® My WiFi Technology (Intel® MWT) | N |
Intel Enhanced Halt State | Y |
Intel Hyper-Threading Technology | N |
Intel® Anti-Theft Technology (Intel® AT) | N |
Intel Virtualization Technology for Directed I/O (VT-d) | N |
Intel® Clear Video HD Technology (Intel® CVT HD) | N |
Intel® Wireless Display (Intel® WiDi) | N |
Hot-swap | N |
---|---|
Hard drive interface | Serial ATA |
Total storage capacity | 160 GB |
Number of hard drives installed | 1 |
CD read speed | 16 x |
---|---|
RAID controller type | SATA |
Manageability features | Lights out 100c |
Mouse | Y |
Internal memory | 4 GB |
---|
Optical drive type | DVD-ROM |
---|---|
Chassis type | Tower |
InTru™ 3D Technology | N |
---|---|
Intel AES New Instructions | N |
Processing die size | 164 mm² |
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