Intel VT-x with Extended Page Tables (EPT) | Y |
---|---|
Intel vPro Technology | N |
Intel Clear Video Technology for MID | N |
Intel® My WiFi Technology (Intel® MWT) | N |
Intel Enhanced Halt State | Y |
Intel Hyper-Threading Technology | N |
Intel® Anti-Theft Technology (Intel® AT) | N |
Intel Virtualization Technology for Directed I/O (VT-d) | Y |
CPU configuration (max) | 1 |
Intel Dual Display Capable Technology | N |
Intel Clear Video Technology | N |
Intel 64 | Y |
Intel® Insider™ | N |
Intel® Quick Sync Video Technology | N |
Intel® Turbo Boost Technology | Y |
Processor ARK ID | 42927 |
Intel Virtualization Technology (VT-x) | Y |
Intel Trusted Execution Technology | Y |
Intel Flex Memory Access | N |
Intel Fast Memory Access | N |
Intel Rapid Storage Technology | N |
Intel® Clear Video HD Technology (Intel® CVT HD) | N |
Intel® Wireless Display (Intel® WiDi) | N |
Intel Demand Based Switching | Y |
Enhanced Intel SpeedStep Technology | Y |
Intel FDI Technology | N |
Hard drive interface | Serial Attached SCSI (SAS), Serial ATA |
---|---|
Maximum storage capacity | 6.4 TB |
Total storage capacity | 250 GB |
Number of hard drives installed | 1 |
Hard drive capacity | 250 GB |
Hard drive size | 3.5 " |
Maximum internal memory supported by processor | 32 GB |
---|---|
Processor frequency | 2.4 GHz |
Stepping | B1 |
Processor cores | 4 |
Processor operating modes | 64-bit |
Embedded options available | Y |
FSB Parity | N |
Number of Processing Die Transistors | 774 M |
Processor manufacturer | Intel |
PCI Express configurations | 4x4, 2x8, 1x16 |
Conflict Free processor | N |
Memory channels supported by processor | Dual |
Memory bandwidth supported by processor (max) | 21 GB/s |
Memory clock speeds supported by processor | 1333, 1066, 800 MHz |
Processor cache type | Smart Cache |
CPU multiplier (bus/core ratio) | 18 |
Processor code | SLBLJ |
Physical Address Extension (PAE) | 36 bit |
Maximum number of PCI Express lanes | 1 |
Processor cache | 8 MB |
Number of processors installed | 1 |
Thermal Design Power (TDP) | 95 W |
Processor lithography | 45 nm |
Processor package size | 37.5 mm |
Thermal Monitoring Technologies | N |
Idle States | Y |
Execute Disable Bit | Y |
Processor boost frequency | 2.8 GHz |
Bus type | DMI |
Memory types supported by processor | DDR3-SDRAM |
Supported instruction sets | SSE4.2 |
ECC supported by processor | Y |
Tcase | 72.7 °C |
PCI Express slots version | 2.0 |
---|
Maximum internal memory | 16 GB |
---|---|
Memory slots | 4 x DIMM |
Internal memory | 2 GB |
Internal memory type | DDR3-SDRAM |
ECC | N |
Optical drive type | DVD-ROM |
---|---|
Chassis type | Micro Tower |
Number of power supply units | 1 |
---|---|
Power supply | 300 W |
Cabling technology | 10/100/1000Base-T(X) |
---|---|
Networking features | Gigabit Ethernet |
Ethernet LAN connection | Y |
---|---|
System bus data transfer rate | 2.5 GT/s |
Processing die size | 296 mm² |
InTru™ 3D Technology | N |
Ethernet LAN (RJ-45) ports quantity | 1 |
Intel AES New Instructions | N |
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