Processor special features
| Intel Demand Based Switching |
Y |
| Enhanced Intel SpeedStep Technology |
Y |
| Intel FDI Technology |
N |
| Intel VT-x with Extended Page Tables (EPT) |
Y |
| Intel vPro Technology |
N |
| Intel Clear Video Technology for MID |
N |
| Intel® My WiFi Technology (Intel® MWT) |
N |
| Intel Enhanced Halt State |
Y |
| Intel Hyper-Threading Technology |
N |
| Intel® Anti-Theft Technology (Intel® AT) |
N |
| Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
| Intel® Turbo Boost Technology |
Y |
| CPU configuration (max) |
1 |
| Intel Dual Display Capable Technology |
N |
| Intel Clear Video Technology |
N |
| Intel 64 |
Y |
| Intel Trusted Execution Technology |
Y |
| Intel Flex Memory Access |
N |
| Intel Fast Memory Access |
N |
| Intel Rapid Storage Technology |
N |
| Intel® Insider™ |
N |
| Intel® Quick Sync Video Technology |
N |
| Processor ARK ID |
42927 |
| Intel Virtualization Technology (VT-x) |
Y |
| Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
| Intel® Wireless Display (Intel® WiDi) |
N |
Processor
| ECC supported by processor |
Y |
| Tcase |
72.7 °C |
| Maximum internal memory supported by processor |
32 GB |
| Processor frequency |
2.4 GHz |
| Stepping |
B1 |
| Processor operating modes |
64-bit |
| Embedded options available |
Y |
| FSB Parity |
N |
| Processor cores |
4 |
| CPU multiplier (bus/core ratio) |
18 |
| Number of Processing Die Transistors |
774 M |
| PCI Express configurations |
4x4, 2x8, 1x16 |
| Conflict Free processor |
N |
| Memory channels supported by processor |
Dual |
| Memory bandwidth supported by processor (max) |
21 GB/s |
| Physical Address Extension (PAE) |
36 bit |
| Maximum number of PCI Express lanes |
1 |
| Thermal Monitoring Technologies |
N |
| Idle States |
Y |
| Execute Disable Bit |
Y |
| Processor cache |
8 MB |
| Thermal Design Power (TDP) |
95 W |
| Processor lithography |
45 nm |
| Processor boost frequency |
2.8 GHz |
| Number of processors installed |
1 |
| Processor package size |
37.5 mm |
| Memory clock speeds supported by processor |
1333, 1066, 800 MHz |
| Processor cache type |
Smart Cache |
| Processor code |
SLBLJ |
| Bus type |
DMI |
| Memory types supported by processor |
DDR3-SDRAM |
| Supported instruction sets |
SSE4.2 |
Other features
| Form factor |
4U |
| CD read speed |
16 x |
Expansion slots
| PCI Express slots version |
2.0 |
Storage
| RAID support |
N |
| Maximum storage capacity |
4 TB |
| Total storage capacity |
250 GB |
| Hot-swap |
N |
Memory
| Maximum internal memory |
8 GB |
| Memory slots |
4 DIMM |
| Internal memory |
2 GB |
Performance
| Remote administration |
Lights-Out 100 Advanced |
Design
| Optical drive type |
DVD-ROM |
| Chassis type |
Tower |
Power
| Number of power supply units |
1 |
| Power supply |
300 W |
Networking
| Networking features |
NC107i PCI Express Gigabit Ethernet |
Additionally
| Ethernet LAN connection |
Y |
| System bus data transfer rate |
2.5 GT/s |
| Processing die size |
296 mm² |
| Chipset |
Intel 3420 |
| Ethernet LAN (RJ-45) ports quantity |
1 |
| InTru™ 3D Technology |
N |
| Intel AES New Instructions |
N |
Hewlett Packard Enterprise ML110 G6 X3430, ProLiant. Processor frequency: 2.4 GHz, Processor family: Intel® Xeon® 3000 Sequence, Processor model: X3430. Total storage capacity: 250 GB, Maximum storage capacity: 4 TB. Internal memory: 2 GB, Maximum internal memory: 8 GB, Memory slots: 4 DIMM. Networking features: NC107i PCI Express Gigabit Ethernet. Remote administration: Lights-Out 100 Advanced
