| Intel® Clear Video HD Technology (Intel® CVT HD) | N |
|---|---|
| Intel® Wireless Display (Intel® WiDi) | N |
| Intel Demand Based Switching | Y |
| Enhanced Intel SpeedStep Technology | Y |
| Intel FDI Technology | N |
| Intel VT-x with Extended Page Tables (EPT) | Y |
| Intel vPro Technology | N |
| Intel Clear Video Technology for MID | N |
| Intel® My WiFi Technology (Intel® MWT) | N |
| Intel Enhanced Halt State | Y |
| Intel Hyper-Threading Technology | Y |
| Intel® Anti-Theft Technology (Intel® AT) | N |
| Intel® Smart Cache | Y |
| Intel Virtualization Technology for Directed I/O (VT-d) | Y |
| CPU configuration (max) | 1 |
| Intel Dual Display Capable Technology | N |
| Intel Clear Video Technology | N |
| Intel 64 | Y |
| Intel® Insider™ | N |
| Intel® Quick Sync Video Technology | N |
| Processor ARK ID | 42929 |
| Intel Virtualization Technology (VT-x) | Y |
| Intel Rapid Storage Technology | N |
| Intel® Turbo Boost Technology | Y |
| Intel Trusted Execution Technology | Y |
| Intel Flex Memory Access | N |
| Intel Fast Memory Access | N |
| ECC supported by processor | Y |
|---|---|
| Tcase | 72.7 °C |
| Maximum internal memory supported by processor | 32 GB |
| Processor frequency | 2.66 GHz |
| Stepping | B1 |
| Processor operating modes | 64-bit |
| Processor cores | 4 |
| Embedded options available | Y |
| FSB Parity | N |
| Number of Processing Die Transistors | 774 M |
| Processor manufacturer | Intel |
| PCI Express configurations | 4x4, 2x8, 1x16 |
| Conflict Free processor | N |
| Physical Address Extension (PAE) | Y |
| Memory channels supported by processor | Dual |
| Memory bandwidth supported by processor (max) | 21 GB/s |
| Memory clock speeds supported by processor | 1333, 1066, 800 MHz |
| Processor cache type | Smart Cache |
| Processor code | SLBLD |
| Physical Address Extension (PAE) | 36 bit |
| Maximum number of PCI Express lanes | 1 |
| Processor package size | 37.5 mm |
| Processor boost frequency | 3.2 GHz |
| Processor cache | 8 MB |
| Number of processors installed | 1 |
| Thermal Design Power (TDP) | 95 W |
| CPU multiplier (bus/core ratio) | 20 |
| Processor lithography | 45 nm |
| Thermal Monitoring Technologies | N |
| Idle States | Y |
| Execute Disable Bit | Y |
| Bus type | DMI |
| Memory types supported by processor | DDR3-SDRAM |
| Supported instruction sets | SSE4.2 |
| Hard drive interface | Serial Attached SCSI (SAS), Serial ATA |
|---|---|
| RAID support | Y |
| Maximum storage capacity | 6.4 TB |
| Total storage capacity | 500 GB |
| Number of hard drives installed | 2 |
| Hard drive capacity | 250 GB |
| Hard drive size | 3.5 " |
| PCI Express slots version | 2.0 |
|---|
| Maximum internal memory | 16 GB |
|---|---|
| Memory slots | 4 x DIMM |
| Internal memory type | DDR3-SDRAM |
| ECC | N |
| Internal memory | 4 GB |
| Number of power supply units | 1 |
|---|---|
| Power supply | 300 W |
| Cabling technology | 10/100/1000Base-T(X) |
|---|---|
| Networking features | Gigabit Ethernet |
| Chassis type | Micro Tower |
|---|---|
| Optical drive type | DVD-ROM |
| Intel AES New Instructions | N |
|---|---|
| Ethernet LAN connection | Y |
| System bus data transfer rate | 2.5 GT/s |
| Processing die size | 296 mm² |
| InTru™ 3D Technology | N |
| Ethernet LAN (RJ-45) ports quantity | 1 |
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