Processor special features
| Intel® My WiFi Technology (Intel® MWT) |
N |
| Intel Enhanced Halt State |
Y |
| Intel® Turbo Boost Technology |
N |
| Intel Hyper-Threading Technology |
Y |
| Intel® Anti-Theft Technology (Intel® AT) |
N |
| Intel Virtualization Technology for Directed I/O (VT-d) |
N |
| CPU configuration (max) |
1 |
| Intel Dual Display Capable Technology |
Y |
| Intel Clear Video Technology |
N |
| Intel 64 |
Y |
| Intel® Insider™ |
N |
| Intel® Quick Sync Video Technology |
N |
| Processor ARK ID |
46472 |
| Intel Trusted Execution Technology |
N |
| Intel Flex Memory Access |
N |
| Intel Fast Memory Access |
N |
| Intel Rapid Storage Technology |
N |
| Intel® Clear Video HD Technology (Intel® CVT HD) |
Y |
| Intel® Wireless Display (Intel® WiDi) |
N |
| Intel Demand Based Switching |
N |
| Enhanced Intel SpeedStep Technology |
Y |
| Intel FDI Technology |
Y |
| Intel VT-x with Extended Page Tables (EPT) |
Y |
| Intel vPro Technology |
N |
| Intel Clear Video Technology for MID |
N |
Expansion slots
| PCI Express slots version |
2.0 |
| PCI Express x4 slots |
2 |
| PCI Express x8 slots |
2 |
| PCI slots |
2 |
Storage
| Maximum storage capacity |
4 TB |
| Total storage capacity |
250 GB |
| Number of hard drives installed |
1 |
| Hot-swap |
Y |
| Hard drive interface |
Serial ATA |
Processor
| Stepping |
C2 |
| Processor operating modes |
64-bit |
| CPU multiplier (bus/core ratio) |
22 |
| Embedded options available |
N |
| FSB Parity |
N |
| Number of Processing Die Transistors |
382 M |
| PCI Express configurations |
2x8, 1x16 |
| Conflict Free processor |
N |
| Memory bandwidth supported by processor (max) |
21 GB/s |
| Processor cache type |
Smart Cache |
| Processor codename |
Clarkdale |
| Processor cores |
2 |
| Physical Address Extension (PAE) |
36 bit |
| Maximum number of PCI Express lanes |
16 |
| Thermal Monitoring Technologies |
N |
| Execute Disable Bit |
Y |
| Graphics & IMC lithography |
45 nm |
| Processor cache |
4 MB |
| Number of processors installed |
1 |
| Maximum number of SMP processors |
1 |
| Thermal Design Power (TDP) |
73 W |
| Processor lithography |
32 nm |
| Processor package size |
37.5 mm |
| Bus type |
DMI |
| Supported instruction sets |
SSE4.2 |
| ECC supported by processor |
N |
| Tcase |
72.6 °C |
| Maximum internal memory supported by processor |
16 GB |
| Processor frequency |
2.93 GHz |
Other features
| Hot-swap hard drive bays |
4x 3.5" SATA/SAS, 8x 2.5" SAS |
Memory
| Maximum internal memory |
32 GB |
| Internal memory type |
DDR3-SDRAM |
| Internal memory |
2 GB |
Graphics
| On-board graphics adapter base frequency |
733 MHz |
| On-board graphics adapter family |
Intel HD Graphics |
| On-board graphics adapter |
Y |
| Number of displays supported (on-board graphics) |
2 |
Design
| Optical drive type |
DVD-ROM |
| Chassis type |
Tower |
Ports & interfaces
| Serial ports quantity |
1 |
| VGA (D-Sub) ports quantity |
1 |
Networking
| Networking features |
Gigabit Ethernet |
Additionally
| Processing die size |
81 mm² |
| InTru™ 3D Technology |
N |
| Ethernet LAN (RJ-45) ports quantity |
2 |
| Intel AES New Instructions |
N |
| System bus data transfer rate |
2.5 GT/s |
System x3200 M3, Intel Core i3-530 (2.93GHz, 4MB), 2048MB PC3-10600 DDR3 RAM, 250GB SATA HDD, DVD-ROM/CD-RW, Gigabit Ethernet
Highlights
-Boost productivity with new high-performance capabilities, vast memory and expanded storage capacity.
-Save on energy costs with integrated power management tools.
-Improve manageability and security with powerful built-in features.
The IBM System x3200 M3 offers enhanced performance to help you take on the dynamic challenges of running IT with an emphasis on security, simplicity, efficiency and reliability – delivered at the right price in a single-socket tower server.
High-performance capabilities
The x3200 M3 supports the latest Intel® Xeon® quad-core and Celeron®, Pentium® and Core i3 dual-core processors for exceptional performance. Because your organisation must manage growing volumes of data while maintaining high performance, the x3200 M3 offers vast memory capacity and disk storage.
Product features
-Easy installation and management with a rich set of options for hard disk drives (HDDs) and memory.
-Efficient design to help you save energy and provide a better work environment with less heat and noise.
-Proven IBM platform tested and certified for quality and reliability.
-Superior serviceability and manageability with features such as the Virtual Media Key, Trusted Platform Module (TPM) 1.2 and Integrated Management Module (IMM) to meet the needs of today’s complex desk-side environment.
-Economical price point and total cost of ownership (TCO).
Hardware summary
-Rack-mountable tower form factor.
-Choice of processor – Intel® Xeon® Processor x3400 Series (quad-core) or Intel Celeron, Pentium or Core i3 (dual-core).
-Up to 32 GB memory, with DDR-3 ECC memory, up to 1333 MHz; 1 GB, 2 GB and 4 GB Unregistered Dual Inline Memory Module (UDIMM); 1 GB, 2 GB, 4 GB and 8 GB.
-registered Dual Inline Memory Module (RDIMMs).
-Flexible storage options – four 3.5" simple-swap or hot-swap Serial Advanced Technology Attachment (SATA) HDDs. Eight 2.5" hot-swap Serial Attached SCSI (SAS) HDDs (2.5" HDD cage will be available for special bid through sales configuration tool).
-Up to 4.0 TB SAS or SATA HDDs.
-Models with hot-swap, redundant power supplies (model dependent).
-DVD-ROM/CD-RW to provide maximum optical drive flexibility.
-Dedicated slot for • Redundant Array of Independent Disk.
-(RAID)-0, -1 controller protects data and leaves other valuable slots free.
-Integrated IMM with IPMI 2.0 support offers better control and manageability of your system.
-Internal tape backup options.
