IBM eServer System x3250 M3 2.4GHz X3430 351W Rack (1U) server

IBM eServer System x3250 M3 2.4GHz X3430 351W Rack (1U) server

MPN: 4251C2G
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Technical specifications

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Processor special features

Intel Clear Video Technology for MID N
Intel® My WiFi Technology (Intel® MWT) N
Intel Enhanced Halt State Y
Intel Hyper-Threading Technology N
Intel® Anti-Theft Technology (Intel® AT) N
Intel Virtualization Technology for Directed I/O (VT-d) Y
CPU configuration (max) 1
Intel Dual Display Capable Technology N
Intel Clear Video Technology N
Intel 64 Y
Intel® Insider™ N
Intel® Turbo Boost Technology Y
Intel® Quick Sync Video Technology N
Processor ARK ID 42927
Intel Virtualization Technology (VT-x) Y
Intel Trusted Execution Technology Y
Intel Flex Memory Access N
Intel Fast Memory Access N
Intel Rapid Storage Technology N
Intel® Clear Video HD Technology (Intel® CVT HD) N
Intel® Wireless Display (Intel® WiDi) N
Intel Demand Based Switching Y
Enhanced Intel SpeedStep Technology Y
Intel FDI Technology N
Intel VT-x with Extended Page Tables (EPT) Y
Intel vPro Technology N

Expansion slots

PCI Express slots version 2.0

Storage

Maximum storage capacity 4 TB
Hot-swap N
Hard drive interface Serial ATA

Processor

Stepping B1
Processor operating modes 64-bit
Embedded options available Y
FSB Parity N
Number of Processing Die Transistors 774 M
PCI Express configurations 4x4, 2x8, 1x16
Conflict Free processor N
Memory channels supported by processor Dual
Memory bandwidth supported by processor (max) 21 GB/s
Memory clock speeds supported by processor 1333, 1066, 800 MHz
Processor cores 4
CPU multiplier (bus/core ratio) 18
Processor cache type Smart Cache
Processor code SLBLJ
Physical Address Extension (PAE) 36 bit
Maximum number of PCI Express lanes 1
Thermal Monitoring Technologies N
Idle States Y
Execute Disable Bit Y
Processor boost frequency 2.8 GHz
Processor cache 8 MB
Number of processors installed 1
Thermal Design Power (TDP) 95 W
Processor lithography 45 nm
Processor package size 37.5 mm
Bus type DMI
Memory types supported by processor DDR3-SDRAM
Supported instruction sets SSE4.2
ECC supported by processor Y
Tcase 72.7 °C
Maximum internal memory supported by processor 32 GB
Processor frequency 2.4 GHz

Memory

Maximum internal memory 24 GB
Memory slots DIMM
Internal memory 2 GB
Internal memory type DDR3-SDRAM
Memory clock speed 1333 MHz

Design

Optical drive type N
Chassis type Rack (1U)

Power

Number of power supply units 1
Power supply 351 W

Other features

Drive bays 2x 3.5", 1x 5.25"

Ports & interfaces

Serial ports quantity 1
VGA (D-Sub) ports quantity 1

Networking

Networking features Gigabit Ethernet

Additionally

Processing die size 296 mm²
Ethernet LAN (RJ-45) ports quantity 2
InTru™ 3D Technology N
Intel AES New Instructions N
Ethernet LAN connection Y
System bus data transfer rate 2.5 GT/s
Graphics G200
System X3250 M3, Xeon X3430, 2.40GHz, 8MB, 2GB, Simple Swap SATA - Ultrathin, rack-optimized, 1U-high form factor.
- Choice of IntelXeon 3400 series (quad-core) up to 2.93 GHz/8 MB/1333 MHz.
- Standard system DDR-3 ECC memory including 1 GB, 2 GB, and 4 GB UDIMMs and 1 GB, 2 GB, 4 GB, and 8 GB RDIMMs.1
- Integrated Serial-ATA (SATA) and Serial Attached SCSI (SAS) controllers, depending on model.
- Two PCI-Express x8 slots.
- Two PCI-e x8 Gen2, optional one PCI-e x8 and one PCI-X (one dedicated PCI-e x4 slot for RAID controller).
- Two 3.5-inch HDDs or four 2.5-inch HDDs.
- Hardware-based RAID striping (RAID-0) and mirroring (RAID-1) standard without consuming an I/O expansion slot, standard for hot-swap models, optional for simple-swap models. Optional hardware RAID-5, depending on model.
- 351-watt, voltage-sensing power supply; high-efficiency power supply (CTO only).
- Integrated, dual Gigabit Ethernet controllers; SATA controller.
- Seven USB ports (two front, four rear, one internal), two Ethernet ports, one serial port, and one video port.
- Integrated Matrox graphics controller with 128 MB video memory.
- Optional hardware key for remote presence.
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